Resin composition and article made therefrom
A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.
1. A resin composition comprising a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least comprises a divinylbenzene, a triallyl compound and a diallyl isophthalate.
2. The resin composition of claim 1 , wherein the vinyl-containing polyphenylene ether resin comprises a vinylbenzyl-containing polyphenylene ether resin, a methacrylate-containing polyphenylene ether resin, an allyl-containing polyphenylene ether resin, a vinylbenzyl-modified bisphenol A polyphenylene ether resin, a chain-extended vinyl-containing polyphenylene ether resin or a combination thereof.
3. The resin composition of claim 1 , wherein the triallyl compound comprises triallyl isocyanurate, triallyl cyanurate or a combination thereof.
4. The resin composition of claim 1 , comprising 90 parts by weight of the vinyl-containing polyphenylene ether resin and 7 to 35 parts by weight of the prepolymer.
5. The resin composition of claim 1 , comprising 90 parts by weight of the vinyl-containing polyphenylene ether resin and 10 to 30 parts by weight of the prepolymer.
6. The resin composition of claim 1 , wherein the divinylbenzene, the triallyl compound and the diallyl isophthalate are present in a weight ratio of 10-20:10-20:5-15.
7. The resin composition of claim 1 , wherein the mixture further comprises maleimide resin, styrene maleic anhydride, 1,2,4-trivinyl cyclohexane, styrene, polyolefin, epoxy resin, cyanate ester resin, maleimide triazine resin, phenolic resin, benzoxazine resin, polyester resin, amine curing agent or a combination thereof.
8. The resin composition of claim 1 , further comprising divinylbenzene, triallyl compound, di(vinylphenyl)ethane, di(vinylphenyl)hexane, diallyl isophthalate, bis(vinylphenyl) dimethyl ether, bis(vinylphenyl) dimethyl benzene, maleimide resin, cyanate ester resin, maleimide triazine resin, polyolefin resin, epoxy resin, phenolic resin, benzoxazine resin, styrene maleic anhydride resin, amine curing agent, polyester resin, polyamide resin, polyimide resin or a combination thereof.
9. The resin composition of claim 1 , further comprising flame retardant, curing accelerator, polymerization inhibitor, surface treating agent, coloring agent, toughening agent, solvent or a combination thereof.
10. An article made from the resin composition of claim 1 , wherein the article comprises a prepreg, a resin film, a laminate or a printed circuit board.
11. The article of claim 10 , having a water absorption rate as measured by reference to IPC-TM-650 2.6.2.1a of less than or equal to 0.10%.
12. The article of claim 10 , having a glass transition temperature as measured by using a dynamic mechanical analyzer by reference to IPC-TM-650 2.4.24.4 of greater than or equal to 196° C.
13. The article of claim 10 , having an inner resin flow after lamination of greater than or equal to 5.00 mm.
14. The article of claim 10 , having a melt viscosity of less than or equal to 300 poises.
15. The article of claim 10 , having a minimum dynamic viscosity of less than or equal to 400 Pa·s.
16. The article of claim 10 , characterized by absence of void in an open area after resin filling.