Sensing sensor
To provide a technique for expanding a measurement dynamic range and performing a stable detection in a sensing sensor using a crystal resonator. A spacer is disposed between an oscillator circuit that oscillates a crystal resonator and a base body that cools an oscillator circuit to a cryogenic temperature, and an oscillator circuit board includes a heater resistor that heats the oscillator circuit. Therefore, the temperature of the oscillator circuit that does not fall below a functional limit temperature and is a low temperature as much as possible can be provided. A negative resistance of the oscillator circuit can be increased, the measurement dynamic range can be expanded, and the crystal resonator can be stably oscillated.
1. A sensing sensor that attaches a substance to be sensed to a piezoelectric resonator, detaches the substance to be sensed by changing a temperature of the piezoelectric resonator, and senses the substance to be sensed based on a relationship between a change of an oscillation frequency and the temperature of the piezoelectric resonator, the substance to be sensed being a gas, the sensing sensor comprising:
a base body, cooled by a liquid nitrogen;
the piezoelectric resonator, cooled by the base body;
a heating unit that heats the piezoelectric resonator for changing the temperature of the piezoelectric resonator;
a substrate mounted to the base body, the substrate including an oscillator circuit unit and a heater circuit thereon, the oscillator circuit unit oscillating the piezoelectric resonator, the heater circuit heating the oscillator circuit unit; and
a heat insulating portion, disposed between the base body and the oscillator circuit unit for avoiding a heat transfer of a cool heat from the base body to the oscillator circuit unit via the substrate.
2. The sensing sensor according to claim 1 , wherein
the oscillator circuit unit includes a semiconductor element containing a silicon, and
the oscillator circuit unit has a temperature controlled to from −170° C. to −110° C.
3. The sensing sensor according to claim 1 , wherein
the heat insulating portion is a spacer with a heat insulating property disposed between the substrate and the base body.
4. The sensing sensor according to claim 1 , wherein
in the substrate, a region on which the oscillator circuit unit is disposed is separated from the base body, and a region outside with respect to the region contacts the base body, and
the heat insulating portion is a through-hole portion formed in the substrate.
5. The sensing sensor according to claim 1 , wherein
the piezoelectric resonator is supported by a supporting member at a position on an opposite side of the base body with respect to the oscillator circuit unit, and
the supporting member and the base body are mutually connected by a heat transfer member that transfers a heat of the piezoelectric resonator to the base body.