Semiconductor device

1. A semiconductor device comprising:

a first conductive layer containing copper;

a second conductive layer containing copper;

a silicon nitride layer provided between the first conductive layer and the second conductive layer;

a silicon oxide layer provided between the silicon nitride layer and the second conductive layer and thicker than the silicon nitride layer;

a silicon oxynitride layer provided between the silicon oxide layer and the second conductive layer and thicker than the silicon oxide layer;

a third conductive layer provided between the first conductive layer and the second conductive layer, the third conductive layer containing copper and electrically connected to the first conductive layer and the second conductive layer;

a first coil; and

a second coil, wherein

a first tilt angle of a plane where the third conductive layer is in contact with the silicon oxynitride layer with respect to a plane parallel to an interface between the silicon nitride layer and the silicon oxide layer is smaller than a second tilt angle of a plane where the third conductive layer is in contact with the silicon oxide layer with respect to a plane parallel to the interface, and

the silicon nitride layer, the silicon oxide layer, and the silicon oxynitride layer are provided between the first coil and the second coil.

2. The semiconductor device according to claim 1 , wherein a distance between the first conductive layer and the second conductive layer is equal to or more than 6 μm.

3. The semiconductor device according to claim 1 , wherein the first tilt angle is equal to or more than 70 degrees and less than 85 degrees, and the second tilt angle is equal to or more than 85 degrees and equal to or less than 90 degrees.

4. The semiconductor device according to claim 1 , wherein a width of a plane where the first conductive layer and the third conductive layer are in contact with each other is equal to or more than 6 μm.

5. The semiconductor device according to claim 1 , wherein the first coil and the first conductive layer are formed of the same material, and the second coil and the second conductive layer are formed of the same material.

6. The semiconductor device according to claim 2 , wherein the first tilt angle is equal to or more than 70 degrees and less than 85 degrees, and the second tilt angle is equal to or more than 85 degrees and equal to or less than 90 degrees.

7. The semiconductor device according to claim 6 , wherein a width of a plane where the first conductive layer and the third conductive layer are in contact with each other is equal to or more than 6 μm.

8. The semiconductor device according to claim 1 , wherein a third length of an interface between the third conductive layer and the silicon oxynitride layer in a cross section parallel to a direction from the first conductive layer towards the second conductive layer is larger than a second length of an interface between the third conductive layer and the silicon oxide layer in the cross section, and the second length is larger than a first length of an interface between the third conductive layer and the silicon nitride layer in the cross section.

9. The semiconductor device according to claim 1 , wherein the first coil and the first conductive layer contact the silicon nitride layer and, and the second coil and the second conductive layer contact the silicon oxynitride layer.

10. The semiconductor device according to claim 9 , wherein a top surface of the first coil and a top surface of the first conductive layer contact the silicon nitride layer and, and a bottom surface of the second coil and a bottom surface of the second conductive layer contact the silicon oxynitride layer.