Radio-frequency module
A radio-frequency module having high design flexibility of a shield with less likelihood of variation in shielding characteristics is provided. A radio-frequency module includes a multilayer circuit board, a component mounted on a top surface of the multilayer circuit board, and a plurality of metal pins having a bent shape such that both end portions can be connected to the top surface of the multilayer circuit board. Each of the plurality of metal pins is provided upright on the top surface of the multilayer circuit board in a state where both end portions are connected to the top surface of the multilayer circuit board, and is arranged near the component to make up a shield member.
1. A radio-frequency module comprising:
a circuit board;
a component mounted on one of main surfaces of the circuit board; and
a plurality of metal pins, each having a first extended portion, a second extended portion, and a third extended portion, one end surface of the first extended portion being connected to an electrode provided on the one of the main surfaces of the circuit board, the first extended portion being extended from the one end surface away from the one of the main surfaces, the second extended portion being bent and extended from one end of the first extended portion on an opposite side from the one end surface, the third extended portion being bent and extended from one end of the second extended portion on an opposite side from the first extending portion to approach the one of the main surfaces, wherein
the plurality of metal pins is disposed around the component to make up a shield member,
a distance between the first extended portion and the third extended portion of each metal pin of the plurality of metal pins is equal to or less than ¼ λ where a wave length of a usage signal of the radio-frequency module is λ, and
for each metal pin of the plurality of metal pins: a distance between the first extended portion of the metal pin and the third extended portion of another one of the plurality of metal pins that is adjacent to the metal pin is equal to or less than ¼ λ.
2. The radio-frequency module according to claim 1 , wherein the plurality of metal pins is connected to a ground electrode.
3. The radio-frequency module according to claim 1 , wherein the plurality of metal pins is arranged around the component so as to surround the component when viewed in a direction perpendicular to the one of the main surfaces of the circuit board.
4. The radio-frequency module according to claim 1 , further comprising:
a sealing resin layer sealing the component,
wherein the sealing resin layer has a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, and
the plurality of metal pins is partially exposed at the opposite surface of the sealing resin layer.
5. The radio-frequency module according to claim 1 , further comprising:
a sealing resin layer having a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, the sealing resin layer sealing the component and the plurality of metal pins, wherein
the plurality of metal pins is not exposed from the opposite surface of the sealing resin layer.
6. The radio-frequency module according to claim 1 , wherein each of the plurality of metal pins is coated with an electrically insulating material.
7. The radio-frequency module according to claim 4 , further comprising:
a shield film coating at least the opposite surface and the side surface of the sealing resin layer, wherein
at least one of the plurality of metal pins is partially exposed at the side surface of the sealing resin layer and contacts the shield film.
8. The radio-frequency module according to claim 4 , further comprising:
an external terminal whose one end is connected to the one of the main surfaces of the circuit board and whose other end is exposed at the opposite surface of the sealing resin layer; and
a component mounted on another one of the main surfaces of the circuit board.
9. The radio-frequency module according to claim 2 , wherein the plurality of metal pins is arranged around the component so as to surround the component when viewed in a direction perpendicular to the one of the main surfaces of the circuit board.
10. The radio-frequency module according to claim 2 , wherein each of the plurality of metal pins is configured such that a distance between the first extended portion and the third extended portion is greater than a width of the component and is arranged in a state where each of the plurality the metal pins straddles over the component.
11. The radio-frequency module according to claim 2 , further comprising:
a sealing resin layer sealing the component,
wherein the sealing resin layer has a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, and
the plurality of metal pins is partially exposed at the opposite surface of the sealing resin layer.
12. The radio-frequency module according to claim 3 , further comprising:
a sealing resin layer sealing the component,
wherein the sealing resin layer has a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, and
the plurality of metal pins is partially exposed at the opposite surface of the sealing resin layer.
13. The radio-frequency module according to claim 2 , further comprising:
a sealing resin layer having a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, the sealing resin layer sealing the component and the plurality of metal pins, wherein
the plurality of metal pins is not exposed from the opposite surface of the sealing resin layer.
14. The radio-frequency module according to claim 3 , further comprising:
a sealing resin layer having a contact surface that contacts the one of the main surfaces of the circuit board, an opposite surface being opposite to the contact surface, and a side surface connecting an edge of the contact surface and an edge of the opposite surface, the sealing resin layer sealing the component and the plurality of metal pins, wherein
the plurality of metal pins is not exposed from the opposite surface of the sealing resin layer.
15. The radio-frequency module according to claim 1 , wherein the second extended portion is parallel to one of four sides of the component when viewed in a direction perpendicular to the main surface of the circuit board.
16. The radio-frequency module according to claim 15 , wherein two or more metal pins are disposed along each of the four sides of the component.
17. The radio-frequency module according to claim 15 , wherein four or more extended portions including the first extended portions and the third extended portions are disposed along each of the four sides of the component.