Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array
A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
1. In a rigid-flex printed circuit board (PCB) array comprising a plurality of rigid PCBs and a flexible PCB, the flexible PCB being formed into a network of flexible connectors interconnecting the rigid PCBs, a method of supplying electrical power from a rigid power supply PCB in the array to a rigid power receiving PCB in the array, the method comprising transmitting a supply voltage from the rigid power supply PCB to the rigid power receiving PCB over at least two power supply paths, the at least two power supply paths comprising a first power supply path and a second power supply path, each of the first and second power supply paths comprising one or more flexible connectors, wherein the first power supply path comprises at least one flexible connector that is not comprised in the second power supply path.
2. The method of claim 1 further comprising transmitting a ground potential from the rigid power supply PCB to the rigid power receiving PCB over at least two power supply paths, the at least two power supply paths comprising a third power supply path and a fourth power supply path, each of the third and fourth power supply paths comprising one or more flexible connectors, wherein the third power supply path comprises at least one flexible connector that is not comprised in the fourth power supply path.
3. The method of claim 1 wherein the first power supply path comprises only a single flexible connector, the single flexible connector linking the rigid power supply PCB directly to the rigid power receiving PCB, whereas the second power supply path comprises at least one intermediate rigid PCB and at least two flexible connectors.
4. The method of claim 1 wherein the first power supply path comprises a first intermediate rigid PCB and at least two flexible connectors and the second power supply path comprises a second intermediate rigid PCB and at least two flexible connectors.
5. The method of claim 1 wherein the first and second power supply paths share at least one intermediate rigid PCB.
6. The method of claim 1 wherein the first and second power supply paths share at least one flexible connector.
7. The method of claim 1 wherein the first and second power supply paths share at least one intermediate rigid PCB and at least one flexible connector.
8. The method of claim 1 wherein the rigid-flex PCB array comprises a plurality of rigid power receiving PCBs and wherein the rigid power supply PCB delivers electrical power to the rigid power receiving PCBs over a plurality of power supply paths, each of the power supply paths comprising a PCB.
9. The method of claim 8 wherein every rigid PCB in the rigid-flex PCB array except for the rigid power supply PCB is a rigid power receiving PCB and wherein the rigid power supply PCB delivers electrical power to every rigid power receiving PCB in the array.
10. The method of claim 1 further comprising connecting a power supply and control circuit to the rigid power supply PCB, the power supply and control circuit being external to the rigid-flex printed circuit board array and supplying electrical power to the rigid power supply PCB.
11. The method of claim 1 wherein the rigid-flex PCB array comprises more than one rigid power supply PCB.
12. The method of claim 1 wherein the rigid power receiving PCB comprises an electrical circuit that requires electrical power in order to operate.
13. The method of claim 12 wherein the electrical circuit comprises at least one light-emitting diode (LED) and a switching device to control an electrical current through and light emitted by the at least one LED.
14. The method of claim 12 wherein the electrical circuit comprises a signal processing circuit.
15. The method of claim 12 wherein the electrical circuit comprises a wireless communication circuit.
16. The method of claim 12 wherein the electrical circuit comprises at least one sensor.
17. The method of claim 16 where the at least one sensor comprises a temperature sensor.
18. The method of claim 16 wherein the at least one sensor comprises a fault detection circuit, the fault detection circuit generating a fault signal when a fault condition occurs in the rigid power receiving PCB.