Plating apparatus and plating method
A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.
1. A plating apparatus comprising:
a plating tank to store a plating solution; and
a plating unit inside the plating tank to perform an electrolytic plating on a plating object; wherein
the plating unit includes:
a partition wall which allows the plating solution to pass through but does not allow the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes downward;
an injector to inject the plating solution upward;
a mixing portion above the injector and below the plating object passage and in which the plating solution injected by the injector and the plating object that has passed through the plating object passage are mixed;
an anode outside the plating object passage;
a cathode inside the plating object passage and including a hollow region through which a fluid mixture of the plating solution and the plating object mixed in the mixing portion flows upward;
a first shielding wall above the cathode and outside the cathode when viewed in the extending direction of the plating object passage to guide the fluid mixture to pass through the hollow region downward; and
a second shielding wall outside the first shielding wall;
a lower end of the first shielding wall is lower than an upper end of the second shielding wall; and
the first shielding wall does not allow either of the plating solution and the plating object to pass through.
2. The plating apparatus according to claim 1 , wherein the upper end of the second shielding wall is higher than a liquid level of the plating solution.
3. The plating apparatus according to claim 1 , further comprising a fluid guide to guide the fluid mixture that has passed upward through the hollow region of the cathode to outside when colliding with the fluid guide.
4. The plating apparatus according to claim 3 , wherein the fluid guide is above the cathode.
5. The plating apparatus according to claim 1 , wherein
an upper end of the anode is lower than a liquid level of the plating solution; and
the plating apparatus further includes an insulator above the anode so as to cover the anode when viewed from above.
6. The plating apparatus according to claim 1 , wherein
an upper end of the anode is higher than a liquid level of the plating solution; and
a portion of the anode higher than a region where the plating object is plated is covered with an insulator.
7. The plating apparatus according to claim 1 , wherein a diameter of an injection port of the injector is smaller than an inner diameter of the cathode.
8. The plating apparatus according to claim 7 , wherein the diameter of the injection port of the injector is about 60% or more of the inner diameter of the cathode.
9. The plating apparatus according to claim 1 , wherein the partition wall has a cylindrical or substantially cylindrical shape.
10. The plating apparatus according to claim 1 , wherein the partition wall is made of a mesh material.
11. The plating apparatus according to claim 1 , wherein an upper portion and a lower portion of the partition wall is impermeable to liquid.