IP Library › Granted Patent US 11,189,905

Granted Patent B2

US 11,189,905 · App. 15/953,075 · Granted Nov 30, 2021

Integrated antenna array packaging structures and methods

Inventors: Xiaoxiong Gu (Scarsdale, NY); Duixian Liu (Scarsdale, NY); Christian W. Baks (Pleasant Valley, NY); Alberto Valdes Garcia (Chappaqua, NY)

Assignee: International Business Machines Corporation

H01Q1/2283 H01L21/4853 H01L21/4857 H01L22/32 H01L23/3672 H01L23/5383 H01L23/5386 H01L23/5389 H01L23/66 H01L24/16 H01Q21/0087 H01Q21/061 H01L2223/6616 H01L2223/6677 H01L2224/16227 H01L2224/16265 H01L2924/15321 H01L2924/15323 H01L2924/1904 H01L2924/19104

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Quick Facts

Patent No.: US 11,189,905
App. No.: 15/953,075
Granted: Nov 30, 2021
Kind: B2

External Links

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Abstract

An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.

Claims (47)

1. An apparatus comprising:

an antenna array package cover comprising:

a radiating surface forming a top surface of the antenna array package cover,

a mating surface disposed opposite the radiating surface and forming a bottom surface of the antenna array package cover, and

an array of antenna array sub-patterns disposed on the radiating surface,

wherein each antenna array sub-pattern of the array of antenna array of sub-patterns comprises at least one antenna element disposed on the radiating surface; and

an array of sub-pattern interface packages coupled to the mating surface of the antenna array package cover,

wherein:

the array of sub-pattern interface packages comprises a plurality of sub-pattern interface packages,

each sub-pattern interface package of the array of sub-pattern interface packages comprises:

a package carrier,

a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and

a set of interface lines corresponding to the at least one antenna element of the antenna array sub-pattern that corresponds to the sub-pattern interface package,

disposing the array of sub-pattern interface packages below the array of antenna array sub-patterns shortens a signal path between each sub-pattern interface pattern and a corresponding antenna element, and

disposing the array of antenna array sub-patterns on the antenna array package cover above the array of sub-pattern interface packages allows adjacent placement of the plurality of sub-pattern interface packages to reduce a surface area of the apparatus.

2. The apparatus of claim 1 , wherein the sub-pattern integrated circuit is flip-chip bonded to the package carrier.

3. The apparatus of claim 1 , wherein the antenna array package cover and the array of sub-pattern interface packages form an antenna array package.

4. The apparatus of claim 3 , wherein the antenna array package is mounted on a host circuit.

5. The apparatus of claim 4 , wherein the antenna array package is mounted on the host circuit via a ball grid array (BGA) or a land grid array (LGA) socket.

6. The apparatus of claim 4 , wherein the host circuit comprises one or more heat sinks that are thermally connected to the plurality of sub-pattern integrated circuits via a plurality of thermal conduits.

7. The apparatus of claim 6 , wherein a thermal conduit of the one or more thermal conduits comprises a pedestal.

8. The apparatus of claim 4 , further comprising a spacer frame disposed between the antenna array package cover and the host circuit.

9. The apparatus of claim 1 , wherein the antenna array package cover comprises a set of antenna feeds for each antenna array sub-pattern of the array of antenna array sub-patterns.

10. The apparatus of claim 1 , wherein the antenna array package cover comprises a test interface element that is electrically connected to at least one sub-pattern integrated circuit.

11. The apparatus of claim 1 , wherein the array of sub-pattern interface packages are secured to the mating surface of the antenna array package cover via one or more of supporting balls, an adhesive, and at least one fastener.

12. The apparatus of claim 1 , wherein the antenna array package cover or the package carrier comprises multiple layers.

13. The apparatus of claim 1 , wherein the package carrier comprises bonding pads for a solder ball grid array.

14. The apparatus of claim 1 , wherein each antenna element comprises a patch of conductive material disposed on or below the radiating surface.

15. The apparatus of claim 1 , wherein the antenna elements are disposed on multiple layers of the antenna array package cover.

16. A system, comprising:

a plurality of antenna arrays arranged in one of a plurality of configurations, wherein each antenna array comprises:

an antenna array package cover comprising a radiating surface forming a top surface of the antenna array package cover, a mating surface disposed opposite the radiating surface and forming a bottom surface of the antenna array package cover, and an array of antenna array sub-patterns disposed on the radiating surface, wherein each antenna array sub-pattern of the array of antenna array of sub-patterns comprises at least one antenna element disposed on the radiating surface; and

an array of sub-pattern interface packages coupled to the mating surface of the antenna array package cover,

wherein:

the array of sub-pattern interface packages comprises a plurality of sub-pattern interface packages,

each sub-pattern interface package of the array of sub-pattern interface packages comprises:

a package carrier,

a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and

a set of interface lines corresponding to the at least one antenna element of the antenna array sub-pattern that corresponds to the sub-pattern interface package,

17. The system of claim 16 , wherein each sub-pattern integrated circuit comprises a flip-chip bonded to the package carrier.

18. The system of claim 16 , wherein the antenna array package cover and each array of sub-pattern interface packages form an antenna array package.

19. The system of claim 16 , wherein the antenna array package cover comprises a test interface element that is electrically connected to at least one sub-pattern integrated circuit.

20. The system of claim 16 , wherein:

each antenna element comprises a patch of conductive material disposed on or below the radiating surface; and

each of the antenna elements are disposed on multiple layers of the antenna array package cover.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2018

From: GU, XIAOXIONG; LIU, DUIXIAN; BAKS, CHRISTIAN W.; VALDES GARCIA, ALBERTO

To: INTERNATIONAL BUSINESS MACHINES CORPORATION

Reel/Frame 045538/0838 →

Continuity (1)

Related Publication 20190319338A1 · Oct 17, 2019

Cited By (4)

US 12,218,407 US 12,418,096 US 12,451,589 US 12,676,424