IP Library › Granted Patent US 11,193,718
Granted Patent B2
US 11,193,718 · App. 16/251,077 · Granted Dec 7, 2021

Heat dissipation unit and heat dissipation device using same

Inventors: Pai-Ling Kao (Shenzhen, CN); Dan-Jun Chen (Shenzhen, CN); Guo-Hui Li (Shenzhen, CN); Fu-Ming Zhong (Shenzhen, CN)
Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
F28D15/043F28D15/046F28F2215/06F28F2240/00F28F2250/10
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Quick Facts
Patent No.
US 11,193,718
App. No.
16/251,077
Filed
Jan 18, 2019
Granted
Dec 7, 2021
Kind
B2
Art Unit
3763
USPC
165/104.26
Abstract

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Claims (9)

1. A heat dissipation unit, comprising a base and a plurality of radiation fins attached to a first side of the base, each of the radiation fins comprising:

a first plate member;

a second plate member closed to the first plate member, one or both of the first and second plate members having a plurality of recesses depressed on one surface and protruding on an opposite surface of the one or both of the first and second plate members;

a plurality of independent flow channels defined between the closed first and second plate members; and

working fluid filled in the plurality of independent flow channels, wherein outer faces of the first and second plate members are configured to directly exchange heat with ambient air such that heat of a heat source attached to a second side of the base is transferred to the radiation fins, is absorbed by the working fluid in the plurality of independent flow channels, and is carried by the working fluid in a vapor phase to ends of the plurality of independent flow channels that are distal the base.

2. The heat dissipation unit of claim 1 , wherein the plurality of recesses include a plurality of first recesses formed on the first plate member and a plurality of second recesses formed on the second plate member and wherein the correspondingly closed first and second plate members bring the first recesses and the second recesses to face and close one another in one-to-one correspondence, such that the paired and closed first and second recesses form the plurality of independent flow channels.

3. The heat dissipation unit of claim 1 , wherein the recesses are formed on the radiation fins by a mechanical process of stamping.

4. The heat dissipation unit of claim 1 , wherein the plurality of independent flow channels respectively have at least one wick structure provided therein selected from the group consisting of a mesh structure, a fibrous structure, a porous structure, and a grooved structure.

5. The heat dissipation unit of claim 4 , wherein the radiation fins further include a coating provided on inner wall surfaces of the independent flow channels and/or the wick structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2019
From: KAO, PAI-LING; CHEN, DAN-JUN; LI, GUO-HUI; ZHONG, FU-MING
To: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
Reel/Frame 048092/0035 →
Continuity (1)
Related Publication 20200232717A1 · Jul 23, 2020