Vertical transport field-effect transistors having germanium channel surfaces
A method for fabricating a semiconductor device including vertical transport fin field-effect transistors (VTFETs) is provided. The method includes forming a bottom spacer on a first device region associated with a first VTFET and a second device region associated with a second VTFET, forming a liner on the bottom spacer, on a first fin structure including silicon germanium (SiGe) formed in the first device region and on a second fin structure including SiGe formed in the second device region, and forming crystalline Ge having a hexagonal structure from the SiGe by employing a Ge condensation process to orient a (111) direction of the crystalline Ge in a direction of charge flow for a VTFET.
1. A method for fabricating a semiconductor device including vertical transport fin field-effect transistors (VTFETs), comprising:
forming a bottom spacer on a first bottom source/drain region of a first VTFET associated with a first device region, on an isolation region, and on a second bottom source/drain region of a second VTFET associated with a second device region;
conformally forming a liner over the bottom spacer, a first fin structure within the first device region and a second fin structure within the second device region, the first and second fin structures each including a fin having a single silicon germanium (SiGe) layer formed from a silicon (Si) surface having a (110) orientation; and
forming crystalline Ge having a hexagonal structure from the SiGe by employing a Ge condensation process under the liner to orient a (111) direction of the crystalline Ge in a vertical direction of charge flow for the first and second VTFETs.
2. The method of claim 1 , wherein the Ge condensation process includes one or more cycles of a three-dimensional (3D) Ge condensation process.
3. The method of claim 2 , wherein the one or more cycles of the 3D Ge condensation process are induced by thermal oxidation.
4. The method of claim 3 , wherein the one or more cycles of the Ge condensation are induced by thermal oxidation in an oxygen gas (O 2 ) environment at a temperature from about 600 degrees Celsius to about 800 degrees Celsius.
5. The method of claim 1 , further comprising forming a first sidewall spacer layer on the first fin structure and a second sidewall spacer layer on the second fin structure.
6. The method of claim 5 , further comprising forming the first bottom source/drain region from a substrate within the first device region, and the second bottom source/drain region from the substrate within the second device region.
7. The method of claim 6 , further comprising performing an anneal process to diffuse dopants from the first and second bottom source/drain regions.
8. The method of claim 1 , further comprising forming the first and second fin structures, including epitaxially growing each fin based on a SiGe film having an initial atomic percentage of Ge less than about 25%.
9. The method of claim 8 , wherein the initial atomic percentage of Ge is less than or equal to about 20%.
10. The method of claim 1 , wherein the liner includes silicon dioxide (SiO 2 ).
11. The method of claim 1 , wherein the first VTFET is an VTFET and the second VTFET is a pFET.
12. The method of claim 1 , further comprising forming the first and second fin structures, including epitaxially growing each fin based on a SiGe film having an initial atomic percentage of Ge less than or equal to about 40%.
13. A method for fabricating a semiconductor device including vertical transport fin field-effect transistors (VTFETs), comprising:
forming a first fin structure in a first device region associated with a first VTFET and a second fin structure a second device region associated with a second VTFET, the first and second fin structures each including a fin having a single silicon germanium (SiGe) layer formed from a silicon (Si) surface having a (110) orientation;
forming a first sidewall spacer layer on the first fin structure and a second sidewall spacer layer on the second fin structure;
forming a first bottom source/drain region from a substrate within the first device region, and a second bottom source/drain region from the substrate within the second device region;
performing an anneal process to diffuse dopants of the first and second bottom source/drain regions;
forming a bottom spacer on the first bottom source/drain region, on an isolation region, and the second bottom source/drain region;
conformally forming a liner over the bottom spacer and the first and second fin structures; and
forming crystalline Ge having a hexagonal structure from the SiGe by employing a Ge condensation process under the liner to orient a (111) direction of the crystalline Ge in a direction of charge flow for the first and second VTFETs.
14. The method of claim 13 , wherein the Ge condensation process includes one or more cycles of a three-dimensional (3D) Ge condensation process.
15. The method of claim 14 , wherein the one or more cycles of the 3D Ge condensation are induced by thermal oxidation in an oxygen gas (O 2 ) environment at a temperature from about 600 degrees Celsius to about 800 degrees Celsius.
16. The method of claim 13 , wherein forming the first and second fin structures further includes epitaxially growing each fin based on a SiGe film having an initial atomic percentage of Ge less than about 25%.
17. The method of claim 16 , wherein the initial atomic percentage of Ge is less than or equal to about 20%.
18. The method of claim 13 , further comprising removing the liner from the bottom spacer and the first and second fin structures.
19. The method of claim 13 , wherein the first VTFET is an nFET and the second VTFET is a pFET.
20. The method of claim 13 , wherein forming the first and second fin structures further includes epitaxially growing each fin from a SiGe film having an initial atomic percentage of Ge less than or equal to about 40%.