Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications
Embodiments include antennas, methods of forming antennas, and a semiconductor package. An antenna includes a feed port disposed in a substrate, and the feed port having a first patch and a second patch. The first patch is disposed on a top surface of substrate, and the second patch is disposed on a bottom surface of substrate. The antenna includes a photoimageable dielectric (PID) disposed on the bottom surface of substrate, where PID surrounds the second patch. The antenna includes a third patch disposed on PID, where the third patch is below the second patch. The antenna includes a cavity disposed between the second and third patches, where the cavity is enclosed by PID and third patch. An additional antenna includes a patch disposed on a first substrate, and a feed port disposed in a second substrate. This antenna includes a composite layer disposed between the first and second substrates.
1. An antenna, comprising:
a feed port in a substrate, the feed port having a first patch and a second patch, wherein the first patch is on a top surface of the substrate, and the second patch is on a bottom surface of the substrate;
a photoimageable dielectric (PID) on the bottom surface of the substrate, wherein the PID surrounds the second patch;
a third patch on the PID, wherein the third patch is below the second patch; and
a cavity between the second patch and the third patch, wherein the cavity is enclosed by the PID and the third patch.
2. The antenna of claim 1 , further comprising:
a first resist on the first patch of the feed port and the top surface of the substrate; and
a second resist on a bottom surface of the PID, wherein the second resist surrounds the third patch.
3. The antenna of claim 1 , wherein the substrate includes a core substrate and a coreless substrate.
4. The antenna of claim 1 , wherein the feed port further comprises:
plated through hole (PTH) vias coupled to the first patch and the second path; and
a resin disposed between the PTH vias and the first and second patches.
5. The antenna of claim 1 , wherein the third patch has a footprint that is greater than both the first patch and the second patch.
6. The antenna of claim 1 , wherein the cavity is an air cavity.
7. The antenna of claim 1 , wherein the cavity has a footprint that is approximately 4 mm by 4 mm or less.
8. The antenna of claim 1 , wherein the cavity isolates heat from traveling between the second patch and the third patch.
9. The antenna of claim 2 , wherein the first and second resists include photodefinable materials.
10. The antenna of claim 1 , wherein the first patch has a footprint that is approximately equal to a footprint of the second patch.
11. An antenna, comprising:
a patch on a first substrate;
a feed port in a second substrate, the feed port having a first patch and a second patch, wherein the first patch is on a top surface of the second substrate, and the second patch is on a bottom surface of the second substrate; and
a composite layer between the first substrate and the second substrate.
12. The antenna of claim 11 , wherein the composite layer attaches a bottom surface of the first substrate to the first patch of the feed port and the top surface of the second substrate.
13. The antenna of claim 11 , wherein the composite layer includes a core material and an ultra-low dielectric constant material.
14. The antenna of claim 11 , further comprising:
a first resist on the patch and a top surface of the first substrate; and
a second resist on a bottom surface of second substrate and the second patch.
15. The antenna of claim 11 , wherein the first substrate includes a core substrate and a coreless substrate.
16. The antenna of claim 11 , wherein the second substrate includes a core substrate and a coreless substrate.
17. The antenna of claim 11 , wherein the feed port further comprises:
plated through hole (PTH) vias coupled to the first patch and the second path; and
a resin disposed between the PTH vias and the first and second patches.
18. The antenna of claim 11 , wherein the first substrate has a thickness that is approximately equal to a thickness of the second substrate.
19. The antenna of claim 11 , wherein the composite layer is an adhesive.
20. The antenna of claim 13 , wherein the ultra-low dielectric constant material has a dielectric constant of approximately of 3 or less and a dielectric loss of approximately of 0.003 or less.
21. The antenna of claim 14 , wherein the first and second resists include photodefinable materials.
22. The antenna of claim 11 , wherein the patch has a footprint that is approximately equal to a footprint of the first patch and a footprint of the second patch, and wherein the first substrate has a thickness that is equal to a thickness of the second substrate.
23. A semiconductor package, comprising:
an interposer on a substrate; and
a die on the interposer; and
at least one of a first antenna and a second antenna on the substrate.
24. The semiconductor package of claim 23 , wherein the first antenna further comprises:
a feed port in a substrate, the feed port having a first patch and a second patch, wherein the first patch is on a top surface of the substrate, and the second patch is on a bottom surface of the substrate;
a photoimageable dielectric (PID) on the bottom surface of the substrate, wherein the PID surrounds the second patch;
a third patch on the PID, wherein the third patch is below the second patch; and
a cavity between the second patch and the third patch, wherein the cavity is enclosed by the PID and the third patch.
25. The semiconductor package of claim 24 , wherein the second antenna further comprises:
a patch on a first substrate;
a feed port in a second substrate, the feed port having a first patch and a second patch, wherein the first patch is on a top surface of the second substrate, and the second patch is on a bottom surface of the second substrate; and
a composite layer between the first substrate and the second substrate.