Cordierite-based sintered body, method for producing the same, and composite substrate
A cordierite-based sintered body according to the present invention contains cordierite as a main component and silicon nitride or silicon carbide. The cordierite-based sintered body preferably has a thermal expansion coefficient less than 2.4 ppm/° C. at 40° C. to 400° C., an open porosity of 0.5% or less, and an average grain size of 1 μm or less.
1. A composite substrate comprising, a piezoelectric substrate bonded to a cordierite-based sintered body support substrate,
wherein the cordierite-based sintered body contains cordierite as a main component and silicon nitride, the cordierite-based sintered body having:
a thermal expansion coefficient less than 2.4 ppm/° C. at 40° C. to 400° C.,
an open porosity of 0.5% or less, and
an average grain size of 0.61 μm or less,
wherein the cordierite-based sintered body has a Young's modulus of 160 GPa or more, and
wherein the cordierite-based sintered body contains silicon nitride and has a polished surface, and when the polished surface is subjected to observation of a backscattered electron image and a composition analysis with an SEM and then an area ratio of a cordierite phase to a silicon nitride phase is determined from a contrast ratio of the image and converted to a volume ratio of the sintered body, the cordierite phase is 60% to 90% by volume and the silicon nitride phase is 10% to 40% by volume;
wherein the polished surface has a center-line average roughness Ra of 1.5 nm or less; and
wherein the polished surface is a surface to which the piezoelectric substrate is bonded.
2. The composite substrate according to claim 1 , wherein the number of pores that have a maximum length of 1 μm or more and present in an area of 100 μm×100 μm of the polished surface is 10 or less.
3. The composite substrate according to claim 1 , wherein the cordierite-based sintered body has a four-point flexural strength of 220 MPa or more.
4. A method for producing a composite substrate in which a piezoelectric substrate is bonded to a cordierite-based sintered body-comprising the steps of:
(a) preparing a raw-material powder mixture by mixing 60% to 90% by volume of a cordierite powder having an average particle diameter of 0.1 to 1 μm and 10% to 40% by volume of a silicon nitride powder having an average particle diameter of 0.1 to 1 μm in a total amount of 100% by; and
(b) producing the cordierite-based sintered body by forming the raw material powder mixture into a compact having a predetermined form and subjecting the compact to hot pressing at a pressing pressure of 20 to 300 kgf/cm 2 and a firing temperature of 1350° C. to 1450° C.,
wherein the cordierite-based sintered body has a thermal expansion coefficient less than 2.4 ppm/° C. at 40° C. to 400° C.,
an open porosity of 0.5% or less, and
an average grain size of 0.61 μm or less, and
wherein the cordierite-based sintered body has a Young's modulus of 160 GPa or more,
wherein the cordierite-based sintered body contains silicon nitride and has a polished surface, and when the polished surface is subjected to observation of a backscattered electron image and a composition analysis with an SEM and then an area ratio of a cordierite phase to a silicon nitride phase is determined from a contrast ratio of the image and converted to a volume ratio of the sintered body, the cordierite phase is 60% to 90% by volume and the silicon nitride phase is 10% to 40% by volume,
wherein the polished surface has a center-line average roughness Ra of 1.5 nm or less, and
wherein the polished surface is a surface to which the piezoelectric functional substrate is bonded.
5. The composite substrate according to claim 1 , wherein the piezoelectric substrate is lithium tantalate or lithium niobate.