Thermal interface materials with radiative coupling heat transfer
View Patent ↗A thermal interface material, a process of forming a thermal interface, the thermal interface including the thermal interface material, and an article of manufacture including the thermal interface material, where the thermal interface material includes polar nanoparticles embedded in one or more carrier materials. The polar nanoparticles may have a diameter of approximately 50-60 nanometers or less, and near-field radiative coupling between the polar nanoparticles. The process of forming the thermal interface including: obtaining the polar nanoparticles; adding the polar nanoparticles to one or more carrier materials to form a carrier mixture, where the polar nanoparticles are embedded in the one or more carrier materials; creating a thermal interface material using the carrier mixture; applying the thermal interface material to a first electronics component and a second electronics component; and compressing the electronics components, where the compressing densely packing the polar nanoparticles.
1. A thermal interface material comprising:
polar nanoparticles embedded in one or more carrier materials, wherein the polar nanoparticles have:
a diameter of approximately 50-60 nanometers or less; and
near-field radiative coupling between the polar nanoparticles.
2. The thermal interface material of claim 1 , wherein:
the polar nanoparticles support surface phonon polaritons; and
the near-field radiative coupling is surface phonon polariton coupling.
3. The thermal interface material of claim 2 , wherein a carrier dielectric constant of the one or more carrier materials is tuned for generation of the surface phonon polaritons.
4. The thermal interface material of claim 2 , wherein the carrier dielectric constant has similar dielectric properties to the polar nanoparticles.
5. The thermal interface material of claim 1 , wherein the polar nanoparticles are SiO 2 nanoparticles.
6. The thermal interface material of claim 1 , wherein the polar nanoparticles are tightly packed in the one or more carrier materials.
7. The thermal interface material of claim 1 , wherein the one or more carrier materials comprise at least one of:
polymer oils, polymer matrices, low melting point waxes, and organic polymers.
8. The thermal interface material of claim 1 , wherein the one or more carrier materials have a refractive index between 1.35 to 3.0.
9. The thermal interface material of claim 8 , wherein the one or more carrier materials have a refractive index between 1.4 to 1.6.
10. The thermal interface material of claim 1 , wherein the one or more carrier materials comprise at least one of:
silicone oil, glycerol, propylene glycol, mineral oils, essential oils, synthetic oils, vacuum pump fluids, vacuum pump contact lubricants, and hydrocarbon based waxes.
11. A process of forming a thermal interface, the process comprising:
obtaining polar nanoparticles having a diameter of approximately 50-60 nanometers or less and near-field radiative coupling between the polar nanoparticles;
adding the polar nanoparticles to one or more carrier materials to form a carrier mixture, wherein the polar nanoparticles are embedded in the one or more carrier materials;
creating a thermal interface material using the carrier mixture;
applying the thermal interface material to a first electronics component and a second electronics component; and
compressing the first electronics component and the second electronics component, wherein the compressing densely packs the polar nanoparticles.
12. The process of claim 11 , wherein:
the polar nanoparticles support surface phonon polaritons; and
the near-field radiative coupling is surface phonon polariton coupling.
13. The process of claim 11 , wherein the polar nanoparticles are SiO 2 nanoparticles.
14. The process of claim 11 , wherein an application method for the applying the thermal interface material is selected from a group consisting of dispense, screen printing, and stenciling.
15. The process of claim 11 , wherein the one or more carrier materials comprise at least one of:
polymer oils, polymer matrices, low melting point waxes, and organic polymers.
16. The process of claim 15 , wherein the one or more carrier materials comprise at least the polymer oil, further comprising:
adding a cross-linking agent to the polymer oil.
17. The process of claim 11 , wherein the first electronics component and the second electronics component are part of at least one of:
a high-power dissipated system, LEDs, data centers, and high heat flux systems.
18. An article of manufacture comprising a thermal interface material, the thermal interface material comprising:
polar nanoparticles embedded in one or more carrier materials, wherein the polar nanoparticles have:
a diameter of approximately 50-60 nanometers or less; and
near-field radiative coupling between the polar nanoparticles.
19. The article of manufacture of claim 18 , wherein:
the polar nanoparticles support surface phonon polaritons; and
the near-field radiative coupling is surface phonon polariton coupling.
20. The article of manufacture of claim 18 , wherein the polar nanoparticles are SiO 2 nanoparticles.