IP Library › Granted Patent US 11,200,479
Granted Patent B2
US 11,200,479 · App. 16/406,875 · Granted Dec 14, 2021

Electromagnetic-coupling dual IC card and IC module

Inventors: Eriko Uehara (Tokyo, JP); Tetsuya Tsukada (Tokyo, JP)
Assignee: TOPPAN PRINTING CO., LTD.
G06K19/07783B42D25/305G06K19/077G06K19/0775G06K19/07747H04B5/02H01Q7/00
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Quick Facts
Patent No.
US 11,200,479
App. No.
16/406,875
Granted
Dec 14, 2021
Kind
B2
Abstract

An electromagnetic-coupling dual IC card includes an IC module and a plate-like card body. The IC module includes a module substrate having a first surface and a second surface, contact terminals provided on the first surface of the module substrate to be contactable with an external contact-type device, an IC chip having a contact communication function and a contactless communication function and disposed on the second surface, and a first connecting coil provided on the first surface. The plate-like card body includes an antenna sheet embedded therein and has a recess for holding the IC module, the antenna sheet being provided with a coupling coil to be electromagnetically coupled to the first connecting coil, and a main coil connected to the coupling coil to perform contactless communication with an external contactless-type device. The first connecting coil does not overlap with the contact terminals in plan view.

Claims (8)

1. An electromagnetic-coupling dual IC card comprising:

an IC module that includes a module substrate having a first surface and a second surface, a plurality of contact terminals provided on the first surface of the module substrate so as to be contactable with an external contact-type device, an IC chip having a contact communication function and a contactless communication function and disposed on the second surface of the module substrate, and a first connecting coil provided on the first surface of the module substrate; and

a card body that includes an antenna sheet and has a recess that holds the IC module, the antenna sheet comprises an antenna having (a) a coupling coil to be electromagnetically coupled to the first connecting coil, and (b) a main coil connected to the coupling coil to perform contactless communication with an external contactless-type device,

wherein the plurality of contact terminals surround the first connecting coil on the first surface of the module substrate.

2. The electromagnetic-coupling dual IC card of claim 1 , wherein the IC module further includes a second connecting coil provided on the second surface of the module substrate.

3. The electromagnetic-coupling dual IC card of claim 2 , wherein the second connecting coil is disposed so as not to overlap with the contact terminals in plan view.

4. The electromagnetic-coupling dual IC card of claim 1 , wherein the first connecting coil provided to the first surface is sealed with a resin.

5. The electromagnetic-coupling dual IC card of claim 1 , wherein the antenna sheet, including the coupling coil and the main coil, is embedded into the card body so that the coupling coil and the main coil are surrounded by a material of the card body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2019
From: UEHARA, ERIKO; TSUKADA, TETSUYA
To: TOPPAN PRINTING CO., LTD.
Reel/Frame 049118/0986 →
Priority Claims (1)
JP JP2016-224863 · Nov 18, 2016 · national
Continuity (2)
Continuation PCTJP2017041550 · Nov 17, 2017
Related Publication 20190266469A1 · Aug 29, 2019