IP Library Granted Patent US 11,201,012
Granted Patent B2
US 11,201,012 · App. 16/721,607 · Granted Dec 14, 2021

Multi-layered ceramic capacitor

Inventors: Ki Myoung Yun (Suwon-si, KR); Jae Sung Park (Suwon-si, KR); Dong Jun Jung (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/1209H01G4/012H01G4/228H01G4/30
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Quick Facts
Patent No.
US 11,201,012
App. No.
16/721,607
Granted
Dec 14, 2021
Kind
B2
Abstract

A multilayer ceramic capacitor includes a ceramic body having a dielectric layer disposed between two internal electrodes. The dielectric layer includes a plurality of dielectric grains. A grain boundary between at least two dielectric grains of the plurality of dielectric grains has a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary that is at least 1 and 6 or less.

Claims (40)

1. A multilayer ceramic capacitor, comprising:

a ceramic body having a dielectric layer disposed between internal electrodes,

wherein the dielectric layer comprises a plurality of dielectric grains and a grain boundary between at least two dielectric grains of the plurality of dielectric grains,

wherein a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary is at least 1 and 6 or less, and

wherein a ratio Ni/Ti of the weight of Ni to a weight of Ti in the grain boundary is 0.1 or less.

2. The multilayer ceramic capacitor of claim 1 , wherein the Ni included in the grain boundary is in an amorphous state together with Si.

3. The multilayer ceramic capacitor of claim 1 , wherein the dielectric grains in the dielectric layer have sizes of 0.1 μm to 0.3 μm.

4. The multilayer ceramic capacitor of claim 1 , wherein the grain boundary has a thickness of 0.7 nm to 1.5 nm.

5. The multilayer ceramic capacitor of claim 1 , wherein the dielectric grains in the dielectric layer have a core-shell structure.

6. The multilayer ceramic capacitor of claim 1 , wherein the dielectric layer has a thickness of 1 or less between the internal electrodes.

7. The multilayer ceramic capacitor of claim 1 , wherein the internal electrodes include a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween.

8. The multilayer ceramic capacitor of claim 7 , further comprising:

a first external electrode electrically connected to the first internal electrode; and

a second external electrode electrically connected to the second internal electrode,

wherein the first and second external electrodes are disposed outside of the ceramic body.

9. The multilayer ceramic capacitor of claim 1 , wherein the internal electrodes are stacked in an active portion of the ceramic body, and the ceramic body further includes a cover portion including dielectric layers disposed above a top-most internal electrode and below a bottom-most internal electrode of the internal electrodes in a stacking direction of the internal electrodes.

10. A multilayer ceramic capacitor comprising:

a plurality of first internal electrodes and a plurality of second internal electrodes that are alternately stacked with each other with dielectric layers therebetween,

wherein each dielectric layer comprises a plurality of dielectric grains with a grain boundary therebetween, and

the grain boundary includes Ni and Ti, and a ratio Ni/Ti of a weight of Ni to a weight of Ti in the grain boundary is 0.1 or less.

11. The multilayer ceramic capacitor of claim 10 , wherein each dielectric layer has a thickness between adjacent first and second internal electrodes of 1 μm or less.

12. The multilayer ceramic capacitor of claim 11 , wherein the grain boundary further includes Si, and a ratio Si/Ni of a weight of Si to the weight of Ni in the grain boundary is at least 1 and 6 or less.

13. The multilayer ceramic capacitor of claim 10 , wherein the grain boundary has a thickness of 0.7 nm to 1.5 nm.

14. The multilayer ceramic capacitor of claim 10 , wherein the dielectric grains of the dielectric layers have a structure including a core and a shell, and the core is free of Si and Ni.

15. The multilayer ceramic capacitor of claim 10 , wherein the dielectric grains of the dielectric layers have a perovskite structure represented by ABO 3 where A includes at least one element selected from barium (Ba), strontium (Sr), lead (Pb), and calcium (Ca), and B includes at least one element selected from titanium (Ti) and zirconium (Zr).

16. The multilayer ceramic capacitor of claim 10 , wherein the dielectric layers further include an oxide or a carbonate including at least one element selected from Mn, V, Cr, Fe, Ni, Co, Cu, and Zn,

the dielectric layers further include an oxide or carbonate including Mg,

the dielectric layers further include an oxide or carbonate including at least one element selected from Y, Dy, Ho, Er, Gd, Ce, Nd, Pm, Eu, Tb, Tm, Yb, Lu and Sm,

the dielectric layers further include an oxide or carbonate including Ba,

the dielectric layers further include an oxide or carbonate including Ca, Ti, and Zr, and

the dielectric layers further include an oxide including at Si or Al, or a glass compound including Si.

17. The multilayer ceramic capacitor of claim 10 , wherein the Ni included in the grain boundary is in an amorphous state together with Si.

18. A multilayer ceramic capacitor comprising:

a plurality of first internal electrodes and a plurality of second internal electrodes that are alternately stacked with each other with dielectric layers therebetween,

wherein each dielectric layer comprises a plurality of dielectric grains with a grain boundary therebetween,

wherein the grain boundary has a thickness of 0.7 nm to 1.5 nm, and

wherein the grain boundary includes Ni and Ti, and a ratio Ni/Ti of a weight of Ni to a weight of Ti in the grain boundary is 0.1 or less.

19. The multilayer ceramic capacitor of claim 18 , wherein the grain boundary further includes Si, and a ratio Si/Ni of a weight of Si to the weight of Ni in the grain boundary is at least 1 and 6 or less.

20. The multilayer ceramic capacitor of claim 18 , wherein the dielectric grains of the dielectric layers have a structure including a core and a shell, and the core is free of Si and Ni.

21. The multilayer ceramic capacitor of claim 18 , wherein the Ni included in the grain boundary is in an amorphous state together with Si.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2019
From: YUN, KI MYOUNG; PARK, JAE SUNG; JUNG, DONG JUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 051397/0006 →
Priority Claims (2)
KR 10-2019-0016771 · Feb 13, 2019 · national
KR 10-2019-0078903 · Jul 1, 2019 · national
Continuity (1)
Related Publication 20200258684A1 · Aug 13, 2020