IP Library › Granted Patent US 11,201,038
Granted Patent B2
US 11,201,038 · App. 16/206,100 · Granted Dec 14, 2021

Support assembly and support assembly assembling method

Inventor: Takehiro Ueda (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01J37/32642H01J37/32715H01L21/67109H01L21/6831H01L21/6833H01L21/68735H01J2237/334H01L21/67069
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Quick Facts
Patent No.
US 11,201,038
App. No.
16/206,100
Granted
Dec 14, 2021
Kind
B2
Abstract

A support assembly includes an electrostatic chuck, a lower electrode, one or more conductive members and a ring-shaped insulating member. The lower electrode has a chuck support surface which supports the electrostatic chuck and a ring support surface which supports an edge ring and surrounds the chuck support surface. A contact electrode is formed on the ring support surface. The conductive members electrically connect the contact electrode and the edge ring. The insulating member is interposed between the ring support surface of the lower electrode and the edge ring while enclosing the conductive members.

Claims (19)

1. A support assembly comprising:

an electrostatic chuck;

a lower electrode having a chuck support surface which supports the electrostatic chuck and a ring support surface which supports an edge ring and surrounds the chuck support surface, wherein a contact electrode is formed on the ring support surface;

one or more conductive members configured to electrically connect the contact electrode and the edge ring; and

a ring-shaped insulating member interposed between the ring support surface of the lower electrode and the edge ring, the insulating member enclosing said one or more conductive members.

2. The support assembly of claim 1 , wherein the insulating member is made of synthetic resin containing silicone.

3. The support assembly of claim 1 , e the contact electrode is provided along the entire circumference of the ring support surface, and

said one or more conductive members are arranged along the entire circumference of the ring-shaped insulating member.

4. The support assembly of claim 1 , wherein an upper surface of the insulating member is in contact with the edge ring and a lower surface of the insulating member is in contact with the lower electrode, and

said one or more conductive members are linear members extending in a thickness direction of the insulating member.

5. The support assembly of claim 3 , wherein an upper surface of the insulating member is in contact with the edge ring and a lower surface of the insulating member is in contact with the lower electrode, and

said one or more conductive members are linear members extending in a thickness direction of the insulating member.

6. The support assembly of claim 1 , wherein the contact electrode is connected to a DC power supply.

7. The support assembly of claim 1 , wherein the contact electrode is connected to an AC power supply.

8. The support assembly of claim 1 , wherein the edge ring is divided.

9. A support assembly assembling method, comprising:

preparing an electrostatic chuck, an edge ring, a lower electrode having a chuck support surface which supports the electrostatic chuck and a ring support surface which supports the edge ring and surrounds the chuck support surface, and an insulating member enclosing one or more conductive members;

forming a contact electrode on the ring support surface; and

fixing the edge ring on the ring support surface through the insulating member to electrically connect the contact electrode, said one or more conductive members and the edge ring.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2018
From: UEDA, TAKEHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 047641/0299 →
Priority Claims (1)
JP JP2017-231776 · Dec 1, 2017 · national
Continuity (1)
Related Publication 20190172688A1 · Jun 6, 2019