IP Library › Granted Patent US 11,201,271
Granted Patent B2
US 11,201,271 · App. 16/780,021 · Granted Dec 14, 2021

Method for manufacturing light emitting device including first and second reflectors

Inventors: Tadao Hayashi (Tokushima, JP); Teruhito Azuma (Anan, JP)
Assignee: NICHIA CORPORATION
H01L33/60H01L33/505H01L33/507H01L33/54H01L33/56H01L33/486H01L2933/0033H01L2933/0058
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Quick Facts
Patent No.
US 11,201,271
App. No.
16/780,021
Granted
Dec 14, 2021
Kind
B2
Abstract

A method for manufacturing a light emitting device includes: forming a first reflector that covers outer peripheral faces of a light transmissive member; forming a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of a light emitting element disposed under the light transmissive member; and forming a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and located outward of the light guiding member.

Claims (23)

1. A method for manufacturing a light emitting device comprising:

providing a combination sheet comprising:

a light transmissive member, and

a first reflector that covers outer peripheral faces of the light transmissive member;

bonding a light emitting element to the light transmissive member of the combination sheet via a light guiding member such that the light guiding member directly contacts a portion of a lower face of the light transmissive member, a portion of a lower face of the first reflector, and portions of lateral faces of the light emitting element and

forming a second reflector that directly contacts a portion of the lower face of the first reflector that is exposed from the light guiding member and located outward of the light guiding member.

2. The method for manufacturing a light emitting device according to claim 1 , wherein:

the first reflector comprises a sheet-shaped reflecting member having an opening in which the light transmissive member is disposed.

3. The method for manufacturing a light emitting device according to claim 1 , wherein the step of providing the combination sheet includes a step of settling a wavelength converting substance in the light transmissive member.

4. The method for manufacturing a light emitting device according to claim 1 , wherein the step of bonding the light emitting element includes a step of providing a thermosetting resin between the light emitting element and the light transmissive member, and a step of curing the thermosetting resin to form the light guiding member.

5. The method for manufacturing a light emitting device according to claim 4 , wherein the first reflector has a second lower face that is located lower than a lower face of the light transmissive member, and the light transmissive member does not contact said second lower face of the first reflector.

6. The method for manufacturing a light emitting device according to claim 1 , wherein, after the second reflector is formed, an entirety of the second reflector is located below the light transmissive member and the first reflector.

7. The method for manufacturing a light emitting device according to claim 1 , further comprising dicing by cutting through the first reflector and the second reflector to singulate the light emitting device.

8. The method for manufacturing a light emitting device according to claim 1 , wherein the light guiding member is substantially free of any wavelength converting sub stance.

9. The method for manufacturing a light emitting device according to claim 1 , wherein an exterior of the light guiding member is outwardly oblique from the lateral faces of the light emitting element in an upward direction.

10. The method for manufacturing a light emitting device according to claim 1 , wherein a width of the light guiding member disposed outward of the light emitting element is in a range of 101% and 200% of a distance between the lateral faces of the light emitting element and an outer edge of the light transmissive member.

11. The method for manufacturing a light emitting device according to claim 1 , wherein a width of the light guiding member disposed outward of the light emitting element is in a range of 100 μm and 200 μm.

12. The method for manufacturing a light emitting device according to claim 1 , wherein a thickness of the light transmissive member is in a range of 50 μm and 200 μm.

13. The method for manufacturing a light emitting device according to claim 1 , wherein the first reflector and the second reflector are made of a resin containing a light reflecting substance.

14. The method for manufacturing a light emitting device according to claim 1 , wherein the light transmissive member comprises a resin containing a wavelength converting sub stance.

15. The method for manufacturing a light emitting device according to claim 1 , wherein at least 80% of a lower face of the light transmissive member is covered by the light guiding member.

16. The method for manufacturing a light emitting device according to claim 1 , wherein corners of the light transmissive member are exposed from the light guiding member.

17. The method for manufacturing a light emitting device according to claim 1 , wherein the first reflector is located entirely outward of the light emitting element in a top view of the light emitting device.

Priority Claims (1)
JP 2015-111795 · Jun 1, 2015 · national
Continuity (2)
Division 15170411 · Jun 1, 2016
Related Publication 20200176651A1 · Jun 4, 2020