Semiconductor device test socket
A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.
1. A semiconductor device test socket comprising:
a plurality of vertical probes each including a contactor having a contact terminal electrically connected to an external connection terminal of a semiconductor device, and a shielding structure which is formed by sequentially laminating a conductive material on an outer edge of the contactor in a coaxial structure using micro an electro mechanical system (MEMS) technology and is electrically connected to a ground;
a connection film which is formed by sequentially laminating a conductive material using the MEMS technology to electrically connect the shielding structures of the plurality of vertical probes formed with a pitch corresponding to the external connection terminal of the semiconductor device; and
an elastic layer which is filled in a space between the contactor and the shielding structure so that the contact terminal of the contactor is exposed after forming the contactor, the shielding structure, and the connection film,
wherein the contactor includes a connection pad formed at a position corresponding to the contact terminal, and a spiral shaped buffer portion configured to connect the contact terminal and the connection pad, and
the buffer portion includes at least one extending portion formed in a Z-axis direction using the MEMS technology, and at least one connection beam formed to be bent in a spiral direction at an XY plane.
2. The semiconductor device test socket of claim 1 , wherein the plurality of shielding structures are formed in a coaxial structure of which a cross-section has a circular shape or a quadrangular shape.
3. The semiconductor device test socket of claim 1 , wherein the plurality of shielding structures are formed to have a height which is the same as the contactor.
4. The semiconductor device test socket of claim 1 , wherein the plurality of shielding structures are formed to be lower than a height of the contactor.
5. The semiconductor device test socket of claim 1 , wherein the plurality of shielding structures and the connection film are made of nickel or a nickel-cobalt alloy as a conductive material.
6. The semiconductor device test socket of claim 1 , wherein an input part opened to inject a liquid elastic layer material is formed in at least one shielding structure among the shielding structures of the plurality of vertical probes.
7. The semiconductor device test socket of claim 1 , wherein:
a pitch between the plurality of vertical probes ranges from 500 to 1000 μm;
a height of the contactor of each of the vertical probes ranges from 450 to 700 μm; and
a separation distance of the space formed between the contactor and the shielding structure is smaller than 100 μm.
8. The semiconductor device test socket of claim 1 , wherein the at least one extending portion includes a first extending portion formed to a predetermined length in the Z-axis direction from a lower surface of the contact terminal, and an eccentric extending portion which is eccentric from the first extending portion in the Z-axis direction and formed to a predetermined height,
wherein the at least one connection beam includes a first connection beam formed to be bent in the spiral direction at the XY plane so that one side is connected to a lower surface of the first extending portion and the other side is connected to an upper surface of the eccentric extending portion,
wherein the at least one extending portion further includes a second extending portion formed to a predetermined height in the Z-axis direction from an upper surface of the connection pad, and
wherein the at least one connection beam further includes a second connection beam formed to be bent in the spiral direction at the XY plane so that one side is connected to an upper surface of the second extending portion and the other side is connected to a lower surface of the eccentric extending portion.
9. The semiconductor device test socket of claim 1 , wherein:
a plurality of contact tips are formed to protrude from an upper surface of the contact terminal; and
each of the plurality of contact tips has a circular cross-section and is formed of a conductive material.
10. The semiconductor device test socket of claim 1 , wherein a material of the elastic layer includes any one of polydimethylsiloxane (PDMS), polyurethane (PU), polyurethane acrylate (PUA), silicone rubber, and polymethylmethacrylate (PMMA).
11. The semiconductor device test socket of claim 1 , wherein:
the plurality of vertical probes are formed on a first surface of a base layer mounted on a test board electrically connected to semiconductor inspection equipment; and
the base layer is formed of polyimide (PI).
12. The semiconductor device test socket of claim 11 , wherein:
a plurality of external connection pads are formed on a second surface of the base layer;
a circuit pattern portion made of a conductive material is formed in the base layer; and
the plurality of external connection pads electrically connect the circuit pattern portion and an electrode terminal of the test board.
13. The semiconductor device test socket of claim 12 , wherein the plurality of external connection pads are formed at regular intervals.
14. The semiconductor device test socket of claim 12 , wherein the plurality of external connection pads are formed at irregular intervals.
15. The semiconductor device test socket of claim 12 , wherein the circuit pattern portion includes a first circuit pattern formed in the base layer to be electrically connected to the external connection pad, a second circuit pattern having one end electrically connected to the first circuit pattern and the other end exposed on the base layer to be electrically connected to one of the vertical probe and the connection film, and a ground pattern.
16. The semiconductor device test socket of claim 15 , wherein the second circuit pattern and the ground pattern are formed of nickel or a nickel-cobalt alloy.
17. The semiconductor device test socket of claim 12 , wherein a pitch between the one external connection pad and an external connection pad adjacent thereto is formed larger than a pitch between the contactor and a contactor adjacent thereto.
18. The semiconductor device test socket of claim 11 , wherein:
an auxiliary connection film and a ground pattern are formed in the first surface of the base layer to have a height the same as the connection film; and
the auxiliary connection film electrically connects the connection film and the ground pattern.
19. The semiconductor device test socket of claim 1 , wherein the buffer portion includes one extending portion and one connection beam and is formed as a single stage.
20. The semiconductor device test socket of claim 1 , wherein the buffer portion includes two extending portions and two connection beams and is formed as a double stage.