Nozzle design for organic vapor jet printing
Nozzle designs which have been found to be effective in governing overspray in OVJP are provided. Aspects of the invention have been found to be effective in reducing or avoiding sudden pressure drops at the end of the nozzle close to the substrate, and may be advantageously employed in obtaining, for example, greater consistency between the nozzle outlet diameter and the deposited pattern width.
1. A method of depositing an organic material, comprising:
introducing a vapor including the organic material into a nozzle via an inlet;
ejecting the vapor from an outlet at a distal end of the nozzle, the outlet having a cross sectional area A1;
after the ejecting, depositing the organic material on a substrate to form at least part of an organic emitting or detecting area,
wherein, the vapor is passed through a portion of the nozzle between the inlet and the outlet at an axial distance L1 from the outlet, the portion of the nozzle having a cross sectional area A2,
wherein A1/A2 is approximately 16, or A1 is approximately 0.6-1.2 mm 2 and A2 is approximately 0.04-0.1 mm 2 , or both, and
wherein a width of the deposited organic material is substantially equal to a width of the outlet.
2. The method of claim 1 , wherein the organic material is deposited without the use of a shadow mask.
3. The method of claim 1 , wherein a shock front of the vapor is formed downstream of the vapor passing through said portion of the nozzle and substantially dissipates prior to the outlet.
4. The method of claim 1 , wherein the outlet has a radius R1 and the portion of the nozzle has a radius R2, and L1/R2 is in a range of approximately 3 to 200.
5. The method of claim 4 , wherein L1/R2 is in a range of approximately 5 to 20.
6. The method of claim 4 , wherein R1/R2 is in a range of approximately 4 to 100.
7. The method of claim 1 , wherein the nozzle is included in a nozzle block with a plurality of similar nozzles, each of the plurality of nozzles configured to deposit an organic emitting material.
8. The method of claim 1 , wherein the vapor is formed into a collimated beam downstream of said portion of the nozzle and upstream of said outlet.
9. A method of depositing an organic material, comprising:
introducing a vapor including the organic material into a nozzle via an inlet;
ejecting the vapor from an outlet at a distal end of the nozzle, the outlet having a cross sectional area A1 and a diameter D1;
after the ejecting, depositing the organic material on a substrate to form at least part of an organic emitting or detecting area,
wherein, the vapor is passed through a portion of the nozzle between the inlet and the outlet at an axial distance L1 from the outlet, the portion of the nozzle having a cross sectional area A2 and a diameter D2,
wherein L1/D2 is greater than 2;
wherein A1/A2 is approximately 16, or A1 is approximately 0.6-1.2 mm 2 and A2 is approximately 0.04-0.1 mm 2 , or both, and
wherein a width of the deposited organic material is substantially equal to a width of the outlet.
10. The method of claim 9 , wherein a shock front of the vapor is formed downstream of the vapor passing through said portion of the nozzle and substantially dissipates prior to the outlet.
11. The method of claim 9 , L1/D2 is in a range of approximately 2 to 200.
12. The method of claim 9 , wherein L1/D2 is in a range of approximately 2 to 20.
13. The method of claim 9 , wherein L1/D2 is approximately 3.
14. The method of claim 9 , wherein D1/D2 is in a range of approximately 4 to 100.
15. The method of claim 9 , wherein the nozzle is included in a nozzle block with a plurality of similar nozzles, each of the plurality of nozzles configured to deposit an organic emitting material.
16. The method of claim 9 , wherein the vapor is formed into a collimated beam downstream of said portion of the nozzle and upstream of said outlet.