Curable resin composition and adhesive for bonding structural material using composition

1. A curable resin composition comprising:

(A1) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin; and

(A2) an epoxy resin excluding component (A1);

(B) a blocked urethane, which is a compound obtained by further reacting a blocking agent (b4) with a polyurethane resin (b3) obtained by reacting a polyol (b1) and a polyisocyanate (b2), wherein the blocking agent (b4) is at least one compound selected from the group consisting of active methylene compounds, oxime compounds, monohydric alcohols, glycol derivatives, amine compounds, phenols and ε-caprolactams; and

(C) a latent curing agent, wherein the latent curing agent (C) is at least one compound selected from the group consisting of dicyandiamide, hydrazides, 4,4′-diaminodiphenylsulfone, boron trifluoride amine complex salt and ureas,

wherein a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

2. The curable resin composition according to claim 1 ,

wherein the epoxy compound (a2) is a bisphenol epoxy resin.

3. An adhesive for bonding a structural material, which uses the curable resin composition according to claim 1 .

4. The adhesive for bonding a structural material according to claim 3 , which is used for bonding aluminum materials.