Measuring deflection to determine a characteristic of a cantilever
View Patent ↗Disclosed are methods that, by not physically touching a material being measured, can measure the material's differential response quite accurately. A collimated light shines on the material under test, is reflected off it, and is then captured by a device that records the position where the reflected light is captured. This process is done both before and after the material is processed in some way (e.g., by applying a coat of paint). The change in position where the reflected light is captured is used in calculating the deflection of the material as induced by the process. This measured induced deflection is then used to accurately determinate the stress introduced into the material by the process. Other characteristics of the material under test, such as aspects of the material composition of a bi-metallic strip, for example, may also be determined from a deflection measurement.
1. A method for determining a stress induced by a first process, the method comprising:
directing collimated first light toward a first original target;
determining an angle between the first directed light and a normal to the first original target;
first receiving some of the first directed light as reflected from the first original target;
determining a first position where the first reflected light is received;
subjecting the first original target to the first process;
directing collimated second light toward the first processed target;
second receiving some of the second directed light as reflected from the first processed target;
determining a second position where the second reflected light is received;
based, at least in part, on the determined angle and on the first and second determined reception positions, calculating a deflection induced into the first processed target; and
based, at least in part, on the calculated induced deflection, calculating a stress induced by the first process into the first processed target, and further comprising;
repeating said steps with a second target and a second process, the second target distinct from the first target, and the second process distinct from the first process;
comparing the calculated stress induced by the first process into the first processed target with the calculated stress induced by the second process into the second processed target; and
based, at least in part, on the comparison of the calculated induced stresses, preparing a recommendation of one of the first and second processes.
2. The method for determining a stress induced by a first process of claim 1 further comprising:
over a period of time, repeating the steps of:
directing collimated second light toward the first processed target;
second receiving some of the second directed light as reflected from the first processed target;
determining a second position where the second reflected light is received; and
based, at least in part, on the determined angle and on the first and second determined reception positions, calculating a deflection induced into the first processed target.
3. The method for determining a stress induced by a first process of claim 2 further comprising:
preparing a time vs. deflection plot for the first processed target.
4. The method for determining a stress induced by a first process of claim 2 further comprising:
halting the repetition of steps when successive changes to the calculated induced deflection go beyond a threshold.
5. The method for determining a stress induced by a first process of claim 1 wherein the first process is selected from the group consisting of: applying a coating, weathering, wetting bombarding with electromagnetic radiation, bombarding with particles, and modifying a surface of the first target.
6. The method for determining a stress induced by a first process of claim 1 wherein directing collimated first light comprises directing laser light.
7. The method for determining a stress induced by a first process of claim 1 wherein determining the angle comprises setting the angle, the setting based, at least in part, on a sensitivity threshold for the calculated induced deflection.
8. The method for determining a stress induced by a first process of claim 1 wherein calculating a stress induced by the first process into the first processed target is based, at least in part, on ASTM Standard D6991.