IP Library Granted Patent US 11,211,282
Granted Patent B2
US 11,211,282 · App. 16/010,239 · Granted Dec 28, 2021

Apparatus to reduce contamination in a plasma etching chamber

Inventors: Xue Chang (San Jose, CA); Andrew Nguyen (San Jose, CA)
Assignee: APPLIED MATERIALS, INC.
H01L21/68785C23C16/4585H01J37/32715H01L21/68735H01L21/68757C23C14/50H01J37/32642H01J2237/334
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Quick Facts
Patent No.
US 11,211,282
App. No.
16/010,239
Granted
Dec 28, 2021
Kind
B2
Abstract

Embodiments of process kit components for use in a substrate support, and substrate supports incorporating same, are provided herein. In some embodiments, the substrate support may include a body, a grounding shell formed of an electrically conductive material disposed about the body, a liner formed of an electrically conductive material disposed about the grounding shell, where the liner includes an upper lip that extends inwardly towards the body, a metal fastener disposed through the upper lip to couple the liner to the grounding shell, and a first insulator ring disposed atop the upper lip of the liner and covering the metal fastener.

Claims (39)

1. A substrate support, comprising:

a body;

a grounding shell formed of an electrically conductive material disposed about the body;

a liner formed of an electrically conductive material disposed about the grounding shell, wherein the liner includes an upper lip that extends inwardly towards the body;

a metal fastener disposed through the upper lip and coupling the liner to the grounding shell;

a first insulator ring disposed atop the upper lip of the liner and covering the metal fastener;

wherein at least one of:

an insulator shell is disposed between the grounding shell and the body, wherein the insulator shell electrically insulates the grounding shell from the body; or

a second insulator ring is disposed between the first insulator ring and the body; and wherein at least one of:

an outer diameter of the first insulator ring is the same as an outer diameter of the second insulator ring, or

the second insulator ring is disposed in a notched upper inside peripheral edge of the first insulator ring.

2. The substrate support of claim 1 , wherein, if the outer diameter of the first insulator rind is not the same as the outer diameter of the second insulator ring, then the outer diameter of the first insulator ring is greater than the outer diameter of the second insulator ring.

3. The substrate support of claim 1 , wherein a top ring is disposed on an upper surface of the second insulator ring.

4. The substrate support of claim 1 , wherein the first insulator ring comprises quartz.

5. The substrate support of claim 4 , wherein the second insulator ring comprises quartz.

6. The substrate support of claim 1 , wherein the first insulator ring has an L-shaped cross section.

7. A substrate support, comprising:

a body;

a shaft extending downward from the body;

a grounding shell peripherally surrounding the body;

a conductive liner disposed about the body, wherein the conductive liner has an upper lip extending inwardly that overlays an upper surface of the grounding shell;

a fastener disposed through the upper lip to couple the conductive liner to the grounding shell;

a first insulator ring disposed atop the upper lip of the conductive liner and covering the fastener; and

a second insulator ring circumscribing the body, wherein the second insulator ring is disposed in a notched upper inside peripheral edge of the first insulator ring.

8. The substrate support of claim 7 , wherein the fastener comprises a screw.

9. The substrate support of claim 7 , wherein the first insulator ring includes a first portion and a second portion, and the second portion is disposed in a notched lower outer peripheral edge of the second insulator ring.

10. The substrate support of claim 7 , wherein both the first insulator ring and the second insulator ring comprise quartz.

11. The substrate support of claim 7 , wherein the first insulator ring comprises at least one of aluminum oxide, anodized aluminum, or aluminum coated with yttrium oxide.

12. The substrate support of claim 7 , wherein the first insulator ring has an outer diameter greater than an outer diameter of the second insulator ring.

13. A substrate support, comprising:

a body having a cylindrical shape and a notched upper peripheral edge defined by a first surface perpendicular to a sidewall of the body;

a conductive shell having a top surface disposed about the body;

a conductive liner disposed about the conductive shell and having an inner lip that extends over the conductive shell;

a plurality of fasteners disposed through the conductive liner to couple the conductive liner to the conductive shell;

a first insulator ring disposed on a top surface of the conductive liner and covering the plurality of fasteners; and

a second insulator ring disposed between the first insulator ring and the body, wherein the second insulator ring is partially disposed within the notched upper peripheral edge of the body and extends outwardly toward the conductive liner.

14. The substrate support of claim 13 , wherein the first insulator ring comprises quartz.

15. The substrate support of claim 13 , wherein an outer diameter of the first insulator ring is the same as an outer diameter of the second insulator ring.

16. The substrate support of claim 13 , wherein the first insulator ring and the second insulator ring have a non-linear interface therebetween.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2018
From: CHANG, XUE; NGUYEN, ANDREW
To: APPLIED MATERIALS, INC.
Reel/Frame 046282/0940 →
Continuity (1)
Related Publication 20190385891A1 · Dec 19, 2019
Cited By (1)
US 12,567,566