Assembly and method for mounting an electronic component to a substrate
In an embodiment, an assembly includes an electronic component, a fixing member, a resilient member and a substrate having a first surface. The electronic component includes a heat-generating semiconductor device, a die pad and a plastic housing. The heat-generating semiconductor device is mounted on a first surface of the die pad, and the die pad is at least partially embedded in the plastic housing. The resilient member is engaged under compression between an upper side of the electronic component and a lower surface of the fixing member and the fixing member secures the electronic component to the first surface of the substrate.
1. An assembly, comprising:
an electronic component comprising:
a semiconductor device;
a die pad; and
a plastic housing;
wherein the semiconductor device is mounted on a first surface of the die pad and the die pad is at least partially embedded in the plastic housing;
a fixing member;
a resilient member; and
a substrate having a first surface;
wherein the resilient member is engaged under compression between an upper side of the electronic component and a lower surface of the fixing member, and the fixing member secures the electronic component to the first surface of the substrate,
wherein the resilient member is a helical spring.
2. The assembly of claim 1 , wherein the electronic component further comprises an aperture and the fixing member is at least partially arranged in the aperture.
3. The assembly of claim 2 , wherein the die pad extends from the plastic housing, and wherein the aperture is arranged in the die pad and adjacent the plastic housing.
4. The assembly of claim 2 , wherein the fixing member includes a head and pin, wherein the pin is arranged in the aperture and extends through a further aperture in the substrate, and wherein the resilient member is engaged under compression between the upper side of the electronic component and an underside of the head of the pin.
5. The assembly of claim 4 , wherein the assembly further comprises a securing member that engages with the fixing member on a second side of the substrate that opposes the first side of the substrate, to secure the electronic component to the first side of the substrate.
6. The assembly of claim 5 , wherein the securing member comprises a screw having a threaded portion that engages with an inner threaded portion of the pin, or the securing member mechanically engages the outer surface of the pin.
7. The assembly of claim 1 , wherein a second surface of the die pad that opposes the first surface is exposed from the plastic housing or covered by the plastic housing.
8. The assembly of claim 1 , wherein the upper side of the electronic component further comprises an indentation for accommodating at least a portion of the resilient member.
9. The assembly of claim 1 , wherein a force applied to the electronic component by the fixing member and the resilient member is between 0.2 Nm and 2 Nm.
10. The assembly of claim 1 , wherein the electronic component has a TO220 or TO247 package outline.
11. A Switched Mode Power Supply comprising the assembly of claim 1 .
12. A method for mounting an electronic component to a substrate, the method comprising:
placing an electronic component on a first surface of a substrate, the electronic component comprising a semiconductor device, a die pad and a plastic housing, wherein the semiconductor device is mounted on a first surface of the die pad and the die pad is at least partially embedded in the plastic housing;
placing a helical spring between an upper side of the electronic component and a lower surface of a fixing member; and
securing the fixing member to the substrate such that the helical spring is compressed between the upper side of the electronic component and the lower surface of the fixing member, and such that a lower surface of the electronic component is pressed onto the first surface of the substrate to mount the electronic component on the substrate.
13. The method of claim 12 , wherein a force of between 0.2 Nm and 2 Nm is applied to the electronic component by securing the fixing member to the substrate.
14. The method of claim 12 , wherein a force of between 0.5 Nm and 1 Nm is applied to the electronic component by securing the fixing member to the substrate.
15. The method of claim 12 , wherein the electronic component further comprises an aperture and the fixing member is at least partially arranged in the aperture.
16. The method of claim 12 , wherein the die pad extends from the plastic housing, and wherein the aperture is arranged in the die pad and adjacent the plastic housing.
17. The method of claim 16 , wherein the fixing member includes a head and pin, wherein the pin is arranged in the aperture and extends through a further aperture in the substrate, and wherein the helical spring is engaged under compression between the upper side of the electronic component and an underside of the head of the pin.
18. The method of claim 17 , wherein the assembly further comprises a securing member that engages with the fixing member on a second side of the substrate that opposes the first side of the substrate, to secure the electronic component to the first side of the substrate.
19. An assembly, comprising:
an electronic component comprising:
a semiconductor device;
a die pad; and
a plastic housing;
wherein the semiconductor device is mounted on a first surface of the die pad and the die pad is at least partially embedded in the plastic housing;
a clamp;
a resilient member; and
a substrate having a first surface;
wherein the resilient member is engaged under compression between an upper side of the plastic housing and a lower surface of the clamp, and the clamp secures the electronic component to the first surface of the substrate without contacting the electronic component.
20. A method for mounting an electronic component to a substrate, the method comprising:
placing an electronic component on a first surface of a substrate, the electronic component comprising a semiconductor device, a die pad and a plastic housing, wherein the semiconductor device is mounted on a first surface of the die pad and the die pad is at least partially embedded in the plastic housing;
placing a resilient member between an upper side of the electronic component and a lower surface of a clamp; and
securing the clamp to the substrate such that the resilient member is compressed between the upper side of the electronic component and the lower surface of the clamp, and such that a lower surface of the electronic component is pressed onto the first surface of the substrate to mount the electronic component on the substrate without the clamp contacting the electronic component.