Slot antenna on a printed circuit board (PCB)
Embodiments herein disclose techniques for apparatuses and methods for making a slot antenna on a PCB with a cutout. A PCB may include a metal layer. The metal layer may include a cavity to be a first radiating element of an antenna, and a slot to be a second radiating element of the antenna. In addition, the cavity may extend to be the cutout of the PCB through other layers of the PCB. The first and second radiating elements may provide a determined transmission frequency for the antenna. The metal layer may further include a portion of a transmission line of the antenna, and the transmission line is in contact with the cavity and the slot. A package may be affixed to the PCB, where a portion of the package may be within the cutout of the PCB. Other embodiments may be described and/or claimed.
1. A method for making a printed circuit board (PCB), comprising:
forming a cutout in the PCB, the cutout extending into a metal layer of the PCB, to form a cavity in the metal layer;
forming a first slot in the metal layer, including disposing the first slot partially around a contour of the cavity;
forming a second slot in the metal layer, including disposing the second slot partially around the contour of the cavity, to complement the disposal of the first slot around the contour of the cavity; and
forming a transmission line in the metal layer, to provide electrical contact with the cavity and the first and second slots disposed around the contour of the cavity,
wherein at least a portion of the transmission line, the cavity, and the first and second slots, formed in the metal layer, form an antenna, wherein the first and second slots and the cavity provide a determined transmission frequency for the antenna.
2. The method of claim 1 ,
wherein the transmission line is in contact with the second slot, and the antenna includes the second slot as a radiating element.
3. The method of claim 1 , wherein the first slot and the second slot are formed around the contour of the cavity.
4. The method of claim 1 , further comprising:
attaching a package to the PCB, wherein a portion of the package is disposed within the cutout of the PCB.