Pin count socket having reduced pin count and pattern transformation
An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.
1. An electronic package adapter comprising:
an interposer comprising a first plurality of contacts and second plurality of contacts configured to electrically connect together electronic devices having different connector layouts,
wherein the first plurality of contacts is disposed on a first surface,
wherein the second plurality of contacts is disposed on a second surface opposing the first surface,
wherein at least one of the first plurality of contacts and at least one of the second plurality of contacts is a signal contact, and at least another of the first plurality of contacts and at least another of the second plurality of contacts is a ground contact, and
wherein the signal contacts of the first plurality of contacts are electrically isolated from each other, the signal contacts of the second plurality of contacts are electrically isolated from each other, and the signal contacts of the first plurality of contacts are electrically connected to the signal contacts of the second plurality of contacts, and the ground contacts of the first and second plurality of contacts are electrically connected together.
2. The electronic package adapter of claim 1 , wherein:
the first plurality of contacts has smaller pin-to-pin pitch than the second plurality of contacts.
3. The electronic package adapter of claim 1 , wherein a maximum thickness of the interposer is between the first and second surfaces on which the first and second plurality of contacts are disposed.
4. The electronic package adapter of claim 1 , wherein the first and second plurality of contacts have different numbers of contacts.
5. The electronic package adapter of claim 4 , wherein:
the first plurality of contacts has a first ratio of signal contacts to ground contacts,
the second plurality of contacts has a second ratio of signal contacts to ground contacts, and
the first ratio is larger than the second ratio.
6. The electronic package adapter of claim 5 , wherein the second plurality of contacts is more numerous than the first plurality of contacts.
7. The electronic package adapter of claim 4 , wherein the first and second plurality of contacts have a same number of signal contacts.
8. The electronic package adapter of claim 1 , wherein the first and second plurality of contacts have different arrangements of signal and ground contacts.
9. The electronic package adapter of claim 8 , wherein:
the first plurality of contacts has a plurality of first cells, and
in each first cell: the signal contacts of the first cell are surrounded by the ground contacts of the first cell.
10. The electronic package adapter of claim 9 , wherein:
the second plurality of contacts has a plurality of second cells,
each second cell has a pattern in which the signal contacts of the second cell are surrounded by the ground contacts of the second cell,
in each second cell: the ground contacts of the second cell are less numerous than the ground contacts of the first cell, and
a number of signal contacts of each first and second cell are equal.
11. The electronic package adapter of claim 1 , further comprising:
a shielded socket including:
an insulator,
signal socket housings disposed within the insulator and through which signal pins connect to the signal contacts of the first plurality of contacts,
ground socket housings disposed within the insulator and through which ground pins connect to the ground contacts of the first plurality of contacts, the ground socket housings having plated socket housings to short the ground pins, and
ground shielding vias between the signal socket housings, the ground shielding vias electrically connected to the ground contacts of the first plurality of contacts to provide shielding between the signal socket housings.
12. An interposer comprising:
an insulator;
a first plurality of contacts disposed on a first surface of the insulator;
a second plurality of contacts disposed on a second surface of the insulator opposing the first surface of the insulator, the first and second plurality of contacts each having signal contacts and ground contacts, the first and second plurality of contacts configured to electrically connect together electronic devices having different connector layouts; and
a ground plane disposed between the first and second surfaces of the insulator and to which the ground contacts of the first and second plurality of contacts are connected,
wherein each of the first plurality of contacts and the second plurality of contacts extends laterally in a direction of the first surface and the second surface to a greater extent than in a thickness direction between the first and second surface.
13. The interposer of claim 12 , wherein the signal contacts of the first plurality of contacts are electrically isolated from each other, the signal contacts of the second plurality of contacts are electrically isolated from each other, and the signal contacts of the first plurality of contacts are electrically connected to the signal contacts of the second plurality of contacts.
14. The interposer of claim 12 , wherein a maximum thickness of the interposer is between the first and second surfaces on which the first and second plurality of contacts are disposed.
15. The interposer of claim 12 , wherein the first and second plurality of contacts have different numbers of contacts.
16. The interposer of claim 15 , wherein the first and second plurality of contacts have a same number of signal contacts.
17. The interposer of claim 12 , wherein the first and second plurality of contacts have different arrangements of signal and ground contacts.
18. An interposer comprising:
an insulator;
a first plurality of contacts disposed on a first surface of the insulator;
a second plurality of contacts disposed on a second surface of the insulator opposing the first surface of the insulator, the first and second plurality of contacts each having signal contacts and ground contacts, the first and second plurality of contacts configured to electrically connect together electronic devices having different connector layouts; and
a ground plane disposed between the first and second surfaces of the insulator and to which the ground contacts of the first and second plurality of contacts are connected by ground vias,
wherein each signal contact of the first plurality of contacts is connected to a corresponding signal contact of the second plurality of contacts, and
wherein additional ground vias extend from the ground plane to the first surface without being connected to any ground contact of the first plurality of contacts.
19. The interposer of claim 18 , wherein the first and second plurality of contacts have at least one of different numbers of contacts or different arrangements of signal and ground contacts.
20. The interposer of claim 18 , wherein each of the first plurality of contacts and the second plurality of contacts extends laterally in a direction of the first surface and the second surface to a greater extent than in a thickness direction between the first and second surface.