IP Library › Granted Patent US 11,212,933
Granted Patent B2
US 11,212,933 · App. 16/821,741 · Granted Dec 28, 2021

Universal carrier for OCP modules

Inventors: Yaw-Tzorng Tsorng (Taoyuan, TW); Shin-Ming Su (Taoyuan, TW); Tung-Hsien Wu (Taoyuan, TW); Wen-Jui Yu (Taoyuan, TW)
Assignee: QUANTA COMPUTER INC.
H05K7/1487H05K1/117H05K1/18H05K7/1417H01R12/7047H01R12/716H05K2201/10189H05K2201/2036
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Quick Facts
Patent No.
US 11,212,933
App. No.
16/821,741
Granted
Dec 28, 2021
Kind
B2
Abstract

An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

Claims (23)

1. An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards, the adaptor assembly comprising:

an adaptor board allowing the attachment of the OCP 2.0 form factor, the adaptor board including a top surface, a socket mateable with a connector on the OCP 2.0 form factor, and an edge connector having golden finger connectors formed on the top surface, the edge connector mateable with a socket on the server; and

an adaptor bracket attachable to the adaptor board, the adaptor bracket having a panel parallel to the adaptor board, and a wall perpendicular to the panel that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

2. The adaptor assembly of claim 1 , wherein the OCP 2.0 form factor card is one of SFPX1, SFPX2, SFPX4, QSFP X1, QSFP X2, RJ-45 X2, RJ-45 X4, or Mezzanine types.

3. The adaptor assembly of claim 1 , wherein the wall includes an aperture that allows access to at least one small form factor pluggable module on the OCP 2.0 form factor.

4. The adaptor assembly of claim 3 , wherein the adaptor board includes a cut-out shaped to accommodate the at least one small form factor pluggable module.

5. The adaptor assembly of claim 1 , wherein the adaptor board includes a distal end and a proximal end, the distal end including the edge connector, wherein the length between the distal end and the proximal end is similar to the length of an OCP 3.0 form factor installable in the server.

6. The adaptor assembly of claim 1 , wherein the adaptor board includes at least one spacer extending to space the form factor from the adaptor board when the form factor is attached to the adaptor board.

7. The adaptor assembly of claim 6 , wherein at least one connection mechanism attaches a circuit board of the form factor to the at least one spacer.

8. The adaptor assembly of claim 1 , wherein the socket is a 120 pin socket, and the connector is a connector A according to the OCP 2.0 specification.

9. The adaptor assembly of claim 1 , wherein the adaptor board includes a second socket mateable with a second connector on the OCP 2.0 form factor.

10. A form factor assembly for insertion in a slot in a server for OCP 3.0 form factors, the assembly comprising:

an OCP 2.0 form factor including a circuit board having a connector;

an adaptor board attached to the OCP 2.0 form factor, the adaptor board including a top surface, a socket mated with the connector of the circuit board of the OCP 2.0 form factor, and an edge connector having golden finger connectors formed on the top surface, the edge connector mateable with a socket on the server; and

an adaptor bracket attached to the adaptor board, the adaptor bracket having a panel parallel to the adaptor broad, and a wall perpendicular to the panel that covers the side slot of the server when the assembly is inserted through the side slot.

11. The form factor assembly of claim 10 , wherein the OCP 2.0 form factor card is one of SFPX1, SFPX2, SFPX4, QSFP X1, QSFP X2, RJ-45 X2, RJ-45 X4 or Mezzanine types.

12. The form factor assembly of claim 10 , wherein the wall includes an aperture that allows access to at least one small form factor pluggable module on the OCP 2.0 form factor.

13. The form factor assembly of claim 12 , wherein the adaptor board includes a cutout shaped to accommodate the at least one small form factor pluggable module.

14. The form factor assembly of claim 10 wherein the adaptor board includes a distal end and a proximal end, the distal end including the edge connector, wherein the length between the distal end and the proximal end is similar to the length of an OCP 3.0 form factor installable in the server.

15. The form factor assembly of claim 11 , wherein the adaptor board includes at least one spacer extending to space the form factor from the adaptor board when the form factor is attached to the adaptor board.

16. The form factor assembly of claim 15 , wherein at least one connection mechanism attaches a circuit board of the form factor to the at least one spacer.

17. The form factor assembly of claim 11 , wherein the socket is a 120 pin socket, and the connector is a connector A according to the OCP 2.0 specification.

18. The form factor assembly of claim 11 , wherein the adaptor board includes a second socket mateable with a second connector on the OCP 2.0 form factor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2020
From: TSORNG, YAW-TZORNG; SU, SHIN-MING; WU, TUNG-HSIEN; YU, WEN-JUI
To: QUANTA COMPUTER INC.
Reel/Frame 052142/0533 →
Continuity (2)
Provisional Application 62923005 · Oct 18, 2019
Related Publication 20210120695A1 · Apr 22, 2021
Cited By (3)
US 12,457,700 US 12,526,950 US 12,696,413