IP Library Granted Patent US 11,215,861
Granted Patent B2
US 11,215,861 · App. 16/317,853 · Granted Jan 4, 2022

Display panel and method for improving display quality thereof

Inventor: Lijun Zhao (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
G02F1/133385G02F1/136286H01L23/38H01L27/1214G02F1/1368G02F1/133514G02F1/133528G02F2201/121G02F2201/123
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Quick Facts
Patent No.
US 11,215,861
App. No.
16/317,853
Granted
Jan 4, 2022
Kind
B2
Abstract

The present disclosure provides a display panel and a method for improving display quality of the display panel. The display panel includes a temperature control apparatus. Specifically, the temperature control apparatus includes a temperature sensor in a non-display area of the display panel for detecting a temperature of the display panel, a change-temperature component in a display area of the display panel for performing a change-temperature treatment on the display panel, and a controller electrically connected to the temperature sensor and the change-temperature component for controlling the change-temperature component to operate according to the temperature of the display panel.

Claims (48)

1. A display panel comprising a temperature control apparatus, the temperature control apparatus comprising:

a temperature sensor in a non-display area of the display panel, wherein the temperature sensor is configured to detect a temperature of the display panel;

a change-temperature component in a display area of the display panel, wherein the change-temperature component is configured to perform a change-temperature treatment on the display panel; and

a controller electrically connected to the temperature sensor and the change-temperature component, wherein the controller is configured to control the change-temperature component to operate according to the temperature of the display panel,

wherein the change-temperature component comprises at least one of a heating component and a heat dissipation component,

wherein the heat dissipation component comprises a semiconductor heat dissipation structure, and

wherein the semiconductor heat dissipation structure comprises:

a first electrode;

a P-type semiconductor layer electrically connected to the first electrode;

an N-type semiconductor layer connected to the P-type semiconductor layer; and

a second electrode electrically connected to the N-type semiconductor layer,

wherein the first electrode and the second electrode are in a same layer, and

wherein the P-type semiconductor layer and the N-type semiconductor layer are in a same layer.

2. The display panel according to claim 1 , wherein the temperature sensor comprises a thin film transistor.

3. The display panel according to claim 1 ,

wherein the display panel further comprises a common electrode, and

wherein the common electrode is configured to act as the heating component.

4. The display panel according to claim 1 , wherein the heat dissipation component comprises a silicon thin film heat sink.

5. The display panel according to claim 1 , wherein the heat dissipation component comprises a plurality of heat dissipation sub-components in an array.

6. The display panel according to claim 1 ,

wherein the display panel further comprises an array substrate, and

wherein the heat dissipation component is on the array substrate.

7. A display panel comprising a temperature control apparatus, the temperature control apparatus comprising:

a temperature sensor in a non-display area of the display panel, wherein the temperature sensor is configured to detect a temperature of the display panel;

a change-temperature component in a display area of the display panel, wherein the change-temperature component is configured to perform a change-temperature treatment on the display panel; and

a controller electrically connected to the temperature sensor and the change-temperature component, wherein the controller is configured to control the change-temperature component to operate according to the temperature of the display panel,

wherein the change-temperature component comprises at least one of a heating component and a heat dissipation component,

wherein the heat dissipation component comprises a semiconductor heat dissipation structure, and

wherein the semiconductor heat dissipation structure comprises:

a first electrode;

a P-type semiconductor layer electrically connected to the first electrode;

an N-type semiconductor layer connected to the P-type semiconductor layer; and

a second electrode electrically connected to the N-type semiconductor layer,

wherein the display panel further comprises a gate signal line, and

wherein the second electrode is connected to the gate signal line.

8. A method for improving display quality of a display panel comprising:

detecting a temperature of the display panel; and

determining whether the temperature of the display panel exceeds a preset temperature range; and

performing a change-temperature treatment on the display panel when the temperature of the display panel exceeds the preset temperature range, such that the temperature of the display panel is maintained within the preset temperature range,

wherein the change-temperature treatment comprises at least one of a heating component and a heat dissipation component,

wherein the heat dissipation component comprises a semiconductor heat dissipation structure, and

wherein the semiconductor heat dissipation structure comprises:

a first electrode;

a P-type semiconductor layer electrically connected to the first electrode;

an N-type semiconductor layer connected to the P-type semiconductor layer; and

a second electrode electrically connected to the N-type semiconductor layer,

wherein the first electrode and the second electrode are in a same laver, and

wherein the P-type semiconductor layer and the N-type semiconductor layer are in a same layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2019
From: ZHAO, LIJUN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 048002/0937 →
Priority Claims (1)
CN 201710517408.X · Jun 29, 2017 · national
Continuity (1)
Related Publication 20200341329A1 · Oct 29, 2020
Cited By (1)
US 12,353,086