Substrate treating composition and method for fabricating a semiconductor device using the same
Provided is a substrate treating composition. The substrate treating composition includes a first monomer, a second monomer and an acid. The first monomer is represented by Formula 1 and the second monomer is represented by Formula 7. The molecular weight of the solid content of the substrate treating composition including the first monomer, the second monomer and the acid is from about 1,000 g/mol to about 50,000 g/mol. X—Si(R1) 2 (R2) [Formula 1] Y—Si(R3) 3 [Formula 7]
1. A method for fabricating a semiconductor device, the method comprising:
applying a composition comprising a first monomer, a second monomer and an acid on a substrate;
performing a baking process to form a monolayer on the substrate; and
forming a photoresist pattern on the monolayer,
wherein the first monomer is represented by Formula 1:
X—Si(R1) 2 (R2) [Formula 1]
wherein each of R1 and R2 is an alkyl group of 1 to 20 carbon atoms or an alkoxy group of 1 to 20 carbon atoms, and X is i) a cyclic amine or an organic group comprising the same, or ii) an alkyl group of 1 to 20 carbon atoms, in which at least one hydrogen atom is substituted with an amino group, a phenyl group in which at least one hydrogen atom is substituted with an amino group or a hydroxyl group, an ester bond, or a combination thereof, the second monomer is represented by Formula 7:
Y—Si(R3) 3 [Formula 7]
wherein R3 is an alkoxy group of 1 to 20 carbon atoms, and Y is i) a cyclic amine or an organic group comprising the same, or ii) an alkyl group of 1 to 20 carbon atoms, in which at least one hydrogen atom is substituted with an amino group, a sulfide bond, an ether bond, an alkyl group of 1 to 20 carbon atoms, which is bonded to a sulfonyl group, or a combination thereof, and
the monolayer comprises a dehydration-condensation product of the first monomer and the second monomer.
2. The method for fabricating a semiconductor device of claim 1 , wherein a silicon (Si) atom in the monolayer is bonded to a silicon (Si) atom in the substrate via a Si—O bond.
3. The method for fabricating a semiconductor device of claim 1 , wherein the monolayer is hydrophobic.
4. A method for fabricating a semiconductor device, the method comprising:
applying a composition comprising a first monomer, a second monomer and an acid on a substrate; and
performing a baking process to form a monolayer on the substrate, wherein the monolayer is bonded to the substrate by a Si—O bond,
wherein the first monomer is represented by Formula 1:
X—Si(R1) 2 (R2) [Formula 1]
wherein each of R1 and R2 is an alkyl group of 1 to 20 carbon atoms or an alkoxy group of 1 to 20 carbon atoms, and X is i) a cyclic amine or an organic group comprising the same, or ii) an alkyl group of 1 to 20 carbon atoms, in which at least one hydrogen atom is substituted with an amino group, a phenyl group in which at least one hydrogen atom is substituted with an amino group or a hydroxyl group, an ester bond, or a combination thereof,
the second monomer is represented by Formula 7:
Y—Si(R3) 3 [Formula 7]
wherein R3 is an alkoxy group of 1 to 20 carbon atoms, and Y is i) a cyclic amine or an organic group comprising the same, or ii) an alkyl group of 1 to 20 carbon atoms, in which at least one hydrogen atom is substituted with an amino group, a sulfide bond, an ether bond, an alkyl group of 1 to 20 carbon atoms, which is bonded to a sulfonyl group, or a combination thereof.
5. The method for fabricating a semiconductor device of claim 4 , wherein a silicon (Si) atom in the monolayer is bonded to a silicon (Si) atom in the substrate via a Si—O bond.
6. The method for fabricating a semiconductor device of claim 4 , wherein the monolayer is hydrophobic.
7. The method for fabricating a semiconductor device of claim 4 , wherein a thickness of the monolayer is about 3 nm or less.
8. The method for fabricating a semiconductor device of claim 4 , wherein the composition further comprises a solvent,
the acid comprised in the composition is a carboxylic acid, and
a molecular weight of a solid content of the composition excluding the solvent is from about 1,000 g/mol to about 50,000 g/mol.
9. The method for fabricating a semiconductor device of claim 4 , wherein the monolayer is formed directly on a surface of the substrate without an intervening layer between the monolayer and the substrate.