Antenna module and electronic device for using the antenna module

1. A mobile communication device, comprising:

a processor positioned on a first printed circuit board;

a radio frequency integrated circuit (RFIC) configured to convert an intermediate frequency (IF) signal to a radio frequency (RF) signal and positioned on the first printed circuit board; and

an antenna module,

wherein the antenna module includes:

a second printed circuit board;

a first antenna and a second antenna, with the first antenna and the second antenna positioned on a first surface of the second printed circuit board; and

a plurality of front-end chips positioned on a second surface of the second printed circuit board, with the second surface being opposite the first surface,

wherein the plurality of front-end chips includes:

a first front-end chip including a first terminal and a first slitter-coupler electrically connected with the first terminal, wherein the first front-end chip is configured to electrically connect the RFIC and the first antenna; and

a second front-end chip including a second terminal, a switch circuit electrically connected with the second terminal, and a second splitter-coupler electrically connected with the switch circuit, wherein the second front-end chip is configured to electrically connect the RFIC and the second antenna,

wherein the first terminal of the first front-end chip and the second terminal of the second front-end chip are electrically connected, and

wherein the processor is configured to:

control the switch circuit to connect the first splitter-coupler and the second splitter-coupler,

control the first front-end chip to transmit a first RF signal received from the RFIC from the first splitter-coupler to the second splitter-coupler, and

control the second front-end chip to transmit the first RF signal from the second splitter-coupler to the second antenna.

2. The mobile communication device of claim 1 , further comprising a third antenna and a fourth antenna that are positioned on the second printed circuit board,

wherein the third antenna is electrically connected with the RFIC by the first front-end chip, and

the fourth antenna is electrically connected with the RFIC by the second front-end chip.

3. The mobile communication device of claim 2 , wherein the first front-end chip includes a first transmission or reception chain and a second transmission or reception chain, wherein the first transmission or reception chain electrically connects the RFIC and the first antenna, and the second transmission or reception chain electrically connects the RFIC and the third antenna; and

the second front-end chip includes a third transmission or reception chain and a fourth transmission or reception chain, wherein the third transmission or reception chain electrically connects the RFIC and the second antenna and the fourth transmission or reception chain electrically connects the RFIC and the fourth antenna.

4. The mobile communication device of claim 2 , wherein the first antenna and the third antenna are configured to operate as a first antenna array for a wireless signal that will be transmitted by the RFIC or a wireless signal that will be received by the RFIC; and

the second antenna and the fourth antenna are configured to operate as a second antenna array for the wireless signal that will be transmitted by the RFIC or the wireless signal that will be received by the RFIC.

5. The mobile communication device of claim 4 , wherein the first antenna and the third antenna configured to operate as the first antenna array are positioned perpendicular to the second antenna and the fourth antenna configured to operate as the second antenna array.

6. The mobile communication device of claim 4 , wherein the processor comprises a communication processor is-configured to;

form a first beam using the first front-end chip and the first antenna array, and

form a second beam using the second front-end chip and the second antenna array.

7. The mobile communication device of claim 6 , wherein the communication processor is further configured to perform an operation of forming the first beam and an operation of forming the second beam such that the first beam and the second beam have the same frequency.

8. The mobile communication device of claim 6 , wherein the communication processor is further configured to perform an operation of forming the first beam toward a first surface of the mobile communication device and an operation of forming a second beam toward a second surface different from the first surface.

9. The mobile communication device of claim 8 , wherein the first antenna is positioned to face the first surface of the mobile communication device,

the second antenna is positioned to face the second surface, and

the first front-end chip is positioned to face a third surface opposite to the first surface.

10. The mobile communication device of claim 9 , wherein the second front-end chip is positioned to face a fourth surface opposite to the second surface.

11. The mobile communication device of claim 1 , wherein the first antenna and the second antenna are configured to operate an antenna array for a wireless signal that will be transmitted by the RFIC or a wireless signal that will be received by the RFIC.

12. The mobile communication device of claim 1 , wherein the RFIC includes a first semiconductor made of a first material, and

the first front-end chip or the second front-end chip includes a second semiconductor made of a second material different from the first material.

13. The mobile communication device of claim 1 , wherein the second printed circuit board has a first rigid printed circuit board portion, a second rigid printed circuit board portion, and a flexible printed circuit board portion connecting the first rigid printed circuit board portion and the second rigid printed circuit board portion,

wherein the first antenna and the first front-end chip are positioned on the first rigid printed circuit board portion, and

wherein the second antenna and the second front-end chip are positioned on the second rigid printed circuit board portion.