Fan-less chiller-less liquid-air cooling for electronic racks of IT components in data centers
A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
1. A data center system, comprising:
a housing to house a plurality of electronic racks of information technology (IT) components operating therein;
a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid;
one or more cooling devices disposed on the IT components to receive a first liquid from the CDU, to exchange heat generated from the IT components using the first liquid, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the CDU to form a first liquid loop, wherein the CDU couples the first liquid loop to a heat dissipating system to carry the exchanged heat to an external environment outside of the housing without a chiller unit; and
an air delivery system to generate a closed-loop airflow from non-contaminated air to cause an airflow to travel through servers of the electronic racks to exchange heat generated by the servers due to operations of the servers, and to remove the exchanged heat to the external environment outside of the housing by an air-to-air heat exchanger.
2. The data center system of claim 1 , wherein the air delivery system comprises a first airspace and a second airspace near a ceiling of the housing such that air circulates through the first airspace to the servers of the electronic racks, then through the second airspace, wherein the first airspace is separated from the second airspace.
3. The data center system of claim 1 , wherein the air delivery system comprises a first airspace and a second airspace, wherein the first airspace is situated under a flooring of the housing, wherein the second airspace is situated above a ceiling of the housing such that air circulates through the first airspace, through the servers of the electronic racks, then through the second airspace, wherein the first airspace is separated from the second airspace.
4. The data center system of claim 1 , wherein the air-to-air heat exchanger is located external to the housing.
5. The data center system of claim 1 , wherein the air-to-air heat exchanger is in a cross flow configuration such that a first airflow is perpendicular to a second airflow of the air-to-air heat exchanger, wherein the first airflow is separated from the second airflow.
6. The data center system of claim 1 , wherein the air-to-air heat exchanger is in a counter flow configuration such that a first airflow is opposite but parallel to a second airflow of the air-to-air heat exchanger, wherein the first airflow is separated from the second airflow.
7. The data center system of claim 1 , wherein each of the electronic racks comprises:
a heat removal liquid manifold to provide heat removal liquid, the heat removal liquid manifold coupled to the CDU;
a plurality of server blades contained in a plurality of server slots respectively, each server blade including an information technology (IT) component representing a server therein, wherein each of the server blades is coupled to the heat removal liquid manifold to receive cooler liquid from the heat removal liquid manifold to remove heat generated by the IT component and to transmit warmer liquid carrying the heat exchanged from the IT component back to the heat removal liquid manifold.
8. The data center system of claim 7 , wherein each of the server blades is coupled to the heat removal liquid manifold modularly such that a server blade can be removed from the electronic rack without affecting operations of remaining server blades on the electronic rack and the heat removal liquid manifold.
9. The data center system of claim 1 , wherein the CDU comprises:
a heat exchanger to exchange heat carried by warmer liquid with an external cooler liquid supplied by an external heat removal system;
a liquid pump to pump the cooler liquid into a heat removal liquid manifold;
a pump controller coupled to the liquid pump; and
a liquid reservoir coupled to the liquid pump.
10. The data center system of claim 9 , wherein the pump controller controls a liquid flow rate based on a temperature of the IT components.
11. The data center system of claim 9 , wherein the pump controller controls liquid flow rate based on a workload of the IT components.
12. The data center system of claim 1 , wherein the one or more cooling devices are one or more liquid cold plates mounted on the IT components.