Chip antenna
A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg 2 SiO 4 phase, an MgAl 2 O 4 phase, and a CaTiO 3 phase, and a content of the CaTiO 3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
1. A chip antenna comprising:
a first substrate;
a second substrate overlapping the first substrate;
a first patch, provided on a first surface of the first substrate;
a second patch, provided on the second substrate;
at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch; and
a ground pad provided on a second surface of the first substrate,
wherein the first substrate comprises a ceramic sintered material, and
wherein the ceramic sintered material comprises an Mg 2 SiO 4 phase, an MgAl 2 O 4 phase, and a CaTiO 3 phase, and a content of the CaTiO 3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
2. The chip antenna of claim 1 , wherein the first patch is a feed patch, and the second patch is a radiation patch.
3. The chip antenna of claim 1 , wherein the first substrate has a dielectric constant of 7.5 to 15.6 at 28 GHz.
4. The chip antenna of claim 1 , wherein the ceramic sintered material is a sintered material of a mixture of MgO particles, SiO 2 particles, Al 2 O 3 particles, and CaTiO 3 particles.
5. The chip antenna of claim 4 , wherein a content of the CaTiO 3 particles in the mixture ranges from 12% by weight to 33% by weight.
6. The chip antenna of claim 5 , wherein a content of the MgO particles in the mixture ranges from 38.5 mol % to 50.2 mol %.
7. The chip antenna of claim 5 , wherein a content of the SiO 2 particles in the mixture ranges from 28.0 mol % to 35.6 mol %.
8. The chip antenna of claim 5 , wherein a content of the Al 2 O 3 particles in the mixture ranges from 7.0 mol % to 9.1 mol %.
9. The chip antenna of claim 1 , wherein the second substrate is formed of a same material as the first substrate.
10. The chip antenna of claim 1 , wherein a thickness of the first substrate corresponds to two to three times a thickness of the second substrate.
11. The chip antenna of claim 1 , wherein the first substrate has a thickness of 150 μm to 500 μm.
12. The chip antenna of claim 1 , wherein the second substrate has a thickness of 50 μm to 200 μm.
13. The chip antenna of claim 1 , further comprising:
a spacer disposed between the first substrate and the second substrate.
14. The chip antenna of claim 1 , further comprising:
a bonding layer disposed between the first substrate and the second substrate.
15. The chip antenna of claim 14 , wherein the bonding layer has a dielectric constant lower than a dielectric constant of the first substrate and a dielectric constant of the second substrate.