Bussing and printed circuit board integration with power electronics
A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.
1. A battery comprising a plurality of electrochemical cells, each cell having electrical terminals, the battery further comprising at least one electrical connection device comprising:
a printed circuit board having a second surface and a first surface, and having a plurality of slots that extend between the second surface and the first surface; and
a bussing element having a second surface and a first surface, and having a plurality of protrusions that extend from the second surface,
wherein the first surface of the printed circuit board is disposed on the second surface of the bussing element,
wherein the plurality of protrusions extend through the plurality of slots, the plurality of slots including a size and shape that corresponds to a protrusion that is configured to extend into the slot, and
wherein the second surface of the printed circuit board and respective second surfaces of the plurality of protrusions form a substantially planar surface.
2. The battery according to claim 1 , further comprising:
a power component having a thermally and electrically conductive surface, and that directly contacts a protrusion of the plurality of protrusions.
3. The battery according to claim 2 , wherein the power component is one of a metal-oxide semiconductor field-effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), a resistor, a light-emitting diode, a power supply, or an electronics module.
4. The battery according to claim 1 , wherein the plurality of protrusions are configured to be directly soldered to a power component.
5. The battery according to claim 1 , further comprising:
another printed circuit board disposed on the bussing element.
6. The battery according to claim 1 , wherein the bussing element is configured to connect to the printed circuit board via at least one of a screw, a bolt, an epoxy, or an adhesive.