Polishing composition
View Patent ↗An object of the present invention is to provide a polishing composition that can achieve both a high polishing removal rate and high surface quality. According to the present invention, provided is a polishing composition for polishing a material to be polished. The polishing composition contains sodium metavanadate, hydrogen peroxide, and silica abrasive. The content C1 of sodium metavanadate is 0.7% to 3.5% by weight, the content C2 of hydrogen peroxide is 0.3% to 3% by weight, and the content C3 of the silica abrasive is 12% to 50% by weight.
1. A polishing composition used for polishing an object to be polished, the polishing composition consisting of:
sodium metavanadate, hydrogen peroxide, silica abrasive, a pH-adjusting agent and water, wherein
the content C1 of sodium metavanadate is 0.7% to 3.5% by weight, the
content C2 of hydrogen peroxide is 0.3% to 3% by weight,
the content C3 of the silica abrasive is 12% to 50% by weight, and
a weight-based ratio of the content C3 of the silica abrasive to the content C1 of sodium metavanadate (C3/C1) is 12.5 or more.
2. The polishing composition according to claim 1 , wherein
a weight-based ratio of the content C2 of hydrogen peroxide to the content C1 of sodium metavanadate (C2/C1) is 0.5 or more and 2 or less, and
a weight-based ratio of the content C3 of the silica abrasive to the content C1 of sodium metavanadate (C3/C1) is 12.5 or more and 40 or less.
3. The polishing composition according to claim 1 , wherein a material constituting the object to be polished has a Vickers hardness of 1,500 Hv or higher.
4. The polishing composition according to claim 1 , wherein a material constituting the object to be polished is silicon carbide.
5. A polishing method comprising:
supplying the polishing composition according to claim 1 to an object to be polished and polishing the object.