Multilayered magnetic free layer structure in magnetic tunnel junction arrays for sub-micrometer resolution pressure sensors
A sub-micrometer pressure sensor is provided that includes a multilayered magnetic tunnel junction (MTJ) pillar that contains a non-magnetic metallic spacer separating a first magnetic free layer from a second magnetic free layer. The presence of the non-magnetic metallic spacer in the multilayered MTJ pillar improves the sensitivity without compromising area, and makes the pressure sensor binary (either “on” or “off”) with little or no drift, and sensitivity change over time. Moreover, the resistivity switch in such a pressure sensor is instantly and a low error rate is observed.
1. A sub-micrometer, binary pressure sensor comprising:
a multilayered magnetic tunnel junction (MTJ) pillar located on a surface of a bottom electrode, wherein the multilayered MTJ pillar comprises a first magnetic reference layer and a second magnetic reference layer that are separated by a non-magnetic metallic spacer; and
a top electrode located on a topmost surface of the multilayered MTJ material pillar.
2. The sub-micrometer, binary pressure sensor of claim 1 , wherein the multilayered MTJ pillar further comprises a magnetic reference layer, a tunnel barrier layer, and a MTJ cap layer, wherein the tunnel barrier forms a first interface with the magnetic reference layer, and a second interface with the first magnetic free layer, and wherein the MTJ cap forms a first interface with the second magnetic reference layer and a second interface with the top electrode.
3. The sub-micrometer, binary pressure sensor of claim 1 , wherein the first magnetic reference layer has a first perpendicular magnetic anisotropy field and the second magnetic reference layer has a second perpendicular magnetic anisotropy field which is greater than the first perpendicular magnetic anisotropy field.
4. The sub-micrometer, binary pressure sensor of claim 1 , wherein the non-magnetic metallic spacer is a compressive elastic metal-containing material.
5. The sub-micrometer, binary pressure sensor of claim 4 , wherein the compressive elastic metal-containing material comprises a metal or metal alloy having a Young's modulus of 120 GPa or less.
6. The sub-micrometer, binary pressure sensor of claim 1 , wherein the non-magnetic metallic spacer is a RKKY metal.
7. The sub-micrometer, binary pressure sensor of claim 6 , wherein the RKKY metal comprises Cr, Ru, Rh, Ir or Os.
8. The sub-micrometer, binary pressure sensor of claim 1 , wherein the non-magnetic metallic spacer has a thickness from 0.05 nm to 30 nm.
9. The sub-micrometer, binary pressure sensor of claim 1 , wherein the bottom electrode is located on a surface of a first electrically conductive structure that is embedded in a first interconnect dielectric material layer.
10. The sub-micrometer, binary meter pressure sensor of claim 9 , further comprising a second interconnect dielectric material layer located above the first interconnect dielectric material layer and laterally surrounding the multilayered MTJ pillar and the top electrode, wherein a second electrically conductive structure is present in the second interconnect dielectric material layer that contacts a surface of the top electrode.
11. The sub-micrometer, binary pressure sensor of claim 9 , wherein the bottom electrode has a topmost surface that is coplanar with a topmost surface of the first interconnect dielectric material layer.
12. The sub-micrometer, binary pressure sensor of claim 1 , further comprising a passivation spacer located on a sidewall of the multilayered MTJ pillar and the top electrode.
13. A method of forming a sub-micrometer, binary pressure sensor, the method comprising:
forming a first electrically conductive structure embedded in a first interconnect dielectric material layer, wherein a bottom electrode is located on a surface of the first electrically conductive structure;
forming a stack of a multilayered magnetic tunnel junction (MTJ) pillar and a top electrode on a surface of the bottom electrode, wherein the multilayered MTJ pillar comprises a first magnetic reference layer and a second magnetic reference layer that are separated by a non-magnetic metallic spacer; and
forming a second electrically conductive structure in a second interconnect dielectric material layer that laterally surrounds the multilayered MTJ pillar and the top electrode, wherein the second electrically conductive structure contacts a surface of the top electrode.
14. The method of claim 13 , wherein the multilayered MTJ pillar further comprises a magnetic reference layer, a tunnel barrier layer, and a MTJ cap layer, wherein the tunnel barrier forms a first interface with the magnetic reference layer, and a second interface with the first magnetic free layer, and wherein the MTJ cap forms a first interface with the second magnetic reference layer and a second interface with the top electrode.
15. The method of claim 13 , wherein the non-magnetic metallic spacer is a compressive elastic metal.
16. The method of claim 15 , wherein the compressive elastic metal-containing material comprises a metal or metal alloy having a Young's modulus of 120 GPa or less.
17. The method of claim 13 , wherein the non-magnetic metallic spacer is a RKKY metal.
18. The method of claim 17 , wherein the RKKY metal comprises Cr, Ru, Rh, Ir or Os.
19. The method of claim 13 , further comprising forming, prior to the forming of the second electrically conductive structure, a passivation layer on physically exposed surfaces of the multilayered MTJ pillar and the top electrode, and wherein during the forming of the passivation layer a portion of the passivation layer located above the top electrode is removed.
20. The method of claim 13 , wherein the first magnetic reference layer has a first perpendicular magnetic anisotropy field and the second magnetic reference layer has a second perpendicular magnetic anisotropy field which is greater than the first perpendicular magnetic anisotropy field.