IP Library › Granted Patent US 11,227,514
Granted Patent B2
US 11,227,514 · App. 16/770,660 · Granted Jan 18, 2022

Cover, manufacturing method of cover, and display device

Inventor: Chunmei He (Hubei, CN)
Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
G09F9/301G06F1/1652G06F1/1656
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,227,514
App. No.
16/770,660
Granted
Jan 18, 2022
Kind
B2
Abstract

The present disclosure provides a cover, a manufacturing method of the cover, and a display device. The cover includes a planar region and a bending region. The cover also includes a substrate, a flexible layer, and a hard layer disposed in a stack. A thickness of the substrate in the planar region is greater than a thickness of the substrate in the bending region. Decreasing the thickness of the substrate in the bending region can improve bendability of the cover, and the hard layer can ensure hardness of the planar region at a same time. Combination of the two can make the cover achieve high hardness and good bendability at the same time.

Claims (30)

1. A cover, comprising a planar region and a bending region connected to the planar region, wherein the cover comprises:

a substrate having a thickness in the planar region that is greater than a thickness in the bending region;

a flexible layer disposed on one side of the substrate; and

a hard layer disposed on one side of the flexible layer away from the substrate;

wherein in the bending region, a groove is defined on one side of the substrate away from the flexible layer.

2. The cover according to claim 1 , wherein a depth of the groove is less than or equal to the thickness of the substrate in the bending region.

3. The cover according to claim 2 , further comprising a filling layer disposed in the groove.

4. The cover according to claim 3 , wherein the filling layer comprises at least one of silicone optical adhesive or self-healing material.

5. The cover according to claim 3 , wherein a thickness of the filling layer is less than or equal to the depth of the groove.

6. A manufacturing method of a cover including a planar region and a bending region connected to the planar region, comprising following steps:

providing a substrate, disposing a flexible layer on one side of the substrate, and defining a groove corresponding to the bending region on one side of the substrate away from the flexible layer, wherein a thickness of the substrate in the planar region is greater than a thickness of the substrate in the bending region; and

disposing a hard layer on one side of the flexible layer away from the substrate.

7. The manufacturing method of the cover according to claim 6 , wherein the step of defining the groove corresponding to the bending region on the side of the substrate away from the flexible layer comprises defining the groove having a depth less than or equal to the thickness of the substrate in the bending region on the side of the substrate away from the flexible layer.

8. The manufacturing method of the cover according to claim 7 , wherein the step of disposing the hard layer on the side of the flexible layer away from the substrate comprises:

disposing a protective layer in the groove, wherein the protective layer extends to cover the side of the substrate away from the flexible layer;

disposing the hard layer on the side of the flexible layer away from the substrate; and

stripping off the protective layer.

9. The manufacturing method of the cover according to claim 8 , further comprising disposing a filling layer in the groove after the step of stripping off the protective layer.

10. The manufacturing method of the cover according to claim 9 , wherein the step of disposing the filling layer in the groove comprises disposing the filling layer having a material of at least one of silicone optical adhesive or self-healing material in the groove.

11. The manufacturing method of the cover according to claim 9 , wherein the step of disposing the filling layer in the groove comprises disposing the filling layer having a thickness less than or equal to the depth of the groove in the groove.

12. The manufacturing method of the cover according to claim 9 , wherein the step of disposing the filling layer in the groove comprises printing to form the filling layer in the groove.

13. A display device, comprising a cover and a display panel, wherein the cover comprises a planar region and a bending region connected to the planar region, wherein the cover further comprises:

a substrate having a thickness in the planar region that is greater than a thickness in the bending region;

a flexible layer disposed on one side of the substrate; and

a hard layer disposed on one side of the flexible layer away from the substrate;

wherein in the bending region, a groove is defined on one side of the substrate away from the flexible layer.

14. The display device according to claim 13 , wherein a depth of the groove is less than or equal to the thickness of the substrate in the bending region.

15. The display device according to claim 14 , wherein the cover further comprises a filling layer disposed in the groove.

16. The display device according to claim 15 , wherein the filling layer comprises at least one of silicone optical adhesive or self-healing material.

17. The display device according to claim 15 , wherein a thickness of the filling layer is less than or equal to the depth of the groove.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2020
From: HE, CHUNMEI
To: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD
Reel/Frame 052862/0720 →
Priority Claims (1)
CN 201911241501.8 · Dec 6, 2019 · national
Continuity (1)
Related Publication 20210174710A1 · Jun 10, 2021
Cited By (1)
US 12,550,275