Conductive features having varying resistance
Methods to form vertically conducting and laterally conducting low-cost resistor structures utilizing dual-resistivity conductive materials are provided. The dual-resistivity conductive materials are deposited in openings in a dielectric layer using a single deposition process step. A high-resistivity β-phase of tungsten is stabilized by pre-treating portions of the dielectric material with impurities. The portions of the dielectric material in which impurities are incorporated encompass regions laterally adjacent to where high-resistivity β-W is desired. During a subsequent tungsten deposition step the impurities may out-diffuse and get incorporated in the tungsten, thereby stabilizing the metal in the high-resistivity β-W phase. The β-W converts to a low-resistivity α-phase of tungsten in the regions not pre-treated with impurities.
1. A method of forming a semiconductor structure, the method comprising:
depositing a dielectric layer;
forming a mask over the dielectric layer, the mask having first opening exposing a first region of the dielectric layer;
implanting impurities into the first region of the dielectric layer;
forming a second opening and a third opening in the dielectric layer, the second opening being in the first region, the third opening being in a second region; and
depositing a metal layer in the second opening and the third opening, wherein the metal layer in the second opening forms a first conductive element and the metal layer in the third opening forms a second conductive element, wherein the dielectric layer adjacent the first conductive element comprises the impurities, wherein the dielectric layer adjacent the second conductive element is free of the impurities.
2. The method of claim 1 , wherein the impurities comprise B, C, or Ge.
3. The method of claim 2 , wherein a dose of the impurities is between 10 14 ions/cm 2 and 5×10 15 ions/cm 2 .
4. The method of claim 1 , wherein the impurities prevent material of the metal layer from changing phases.
5. The method of claim 1 , wherein the first conductive element comprises a β-phase metal and the second conductive element comprises an α-phase metal.
6. The method of claim 1 , wherein implanting impurities is performed prior to forming the second opening and the third opening.
7. The method of claim 1 , wherein the first conductive element comprises a laterally conducting resistor.
8. A method of forming a semiconductor structure, the method comprising:
depositing a dielectric layer;
forming a first opening in the dielectric layer;
incorporating impurities into the dielectric layer;
forming a second opening in the dielectric layer; and
forming a metal layer in the first opening and the second opening, wherein the impurities are incorporated along sidewalls of the first opening, wherein the metal layer in the first opening forms a first conductive element and the metal layer in the second opening forms a second conductive element, wherein sidewalls of the second opening are free of the incorporated impurities.
9. The method of claim 8 , wherein forming the first opening is performed prior to incorporating the impurities.
10. The method of claim 8 , wherein the impurities reduce a transition of the metal layer from a β-phase metal to an α-phase metal in the first opening, wherein forming the metal layer in the second opening forms an α-phase metal.
11. The method of claim 8 , wherein the first conductive element forms a vertical resistor.
12. The method of claim 8 , wherein the first conductive element forms a lateral resistor.
13. The method of claim 8 , wherein forming the first opening and forming the second opening are performed simultaneously.
14. The method of claim 13 , further comprising:
forming a mask over the second opening prior to implanting the impurities; and
removing the mask after implanting the impurities.
15. The method of claim 8 , wherein the impurities comprise B, C, or Ge at a dose of between 10 14 ions/cm 2 and 5×10 15 ions/cm 2 .
16. A method of forming a semiconductor structure, the method comprising:
depositing a dielectric layer;
forming a first opening in a first region and a second opening in a second region of the dielectric layer;
after forming the first opening and the second opening, forming a mask over the dielectric layer, the mask having third opening exposing the first opening in the first region of the dielectric layer;
after forming the mask, implanting impurities into the first region of the dielectric layer, wherein sidewalls of the first opening in the dielectric layer are implanted with impurities; and
after implanting the impurities, depositing a metal layer in the first opening and the second opening, wherein the metal layer in the first opening forms a first conductive element and the metal layer in the second opening forms a second conductive element.
17. The method of claim 16 , wherein the impurities comprise nitrogen, hydrogen, boron, carbon, or germanium.
18. The method of claim 17 , wherein the metal layer comprises tungsten.
19. The method of claim 16 , wherein the second opening is covered by the mask while implanting the impurities.
20. The method of claim 16 , wherein the first conductive element has a different resistance value than the second conductive element.