IP Library › Granted Patent US 11,227,840
Granted Patent B2
US 11,227,840 · App. 16/524,496 · Granted Jan 18, 2022

Electronic module having improved shield performance

Inventors: Yoshihito Otsubo (Kyoto, JP); Motohiko Kusunoki (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01L23/552H01L23/3121H01L25/165H03F3/04H01L23/49822H03F2200/114H03F2200/222H03F2200/294
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Quick Facts
Patent No.
US 11,227,840
App. No.
16/524,496
Granted
Jan 18, 2022
Kind
B2
Abstract

A module includes a substrate having a main surface, a first component mounted on the main surface, and a first wire group constituted of three or more wires in parallel with each other that are bonded to the main surface so as to straddle the first component while extending in a first direction. When sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length.

Claims (30)

1. A module comprising:

a substrate having a main surface;

a first component mounted on the main surface; and

a first wire group constituted of three or more wires disposed in parallel with each other that are bonded to the main surface so as to straddle the first component while extending in a first direction, wherein the first direction obliquely intersects with a longitudinal direction of the first component,

wherein when sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length, such that in a region where the first component is straddled in plan view, distances between adjacent wires vary.

2. The module according to claim 1 , including a second component mounted on the main surface,

wherein a row in which one ends of the wires in the first section are lined up is located between the first component and the second component.

3. The module according to claim 1 , including a second wire group arranged in a direction different from the first wire group and constituted of three or more wires disposed in parallel with each other that are bonded to the main surface so as to straddle the first component.

4. The module according to claim 3 ,

wherein when sections are defined along the first direction, the second wire group includes a third section in which a distance between wires adjacent to each other is a third length and a fourth section in which a distance between wires adjacent to each other is a fourth length longer than the third length.

5. The module according to claim 3 ,

wherein the three or more wires of the first wire group and the three or more wires of the second wire group are orthogonal to each other.

6. The module according to claim 1 , including a sealing resin configured to cover the first component and the three or more wires.

7. The module according to claim 1 , including a shield film spaced apart from the main surface and configured to cover the first component and the first wire group.

8. The module according to claim 7 ,

wherein at least any wire of the first wire group is in contact with the shield film.

9. The module according to claim 3 , including a shield film spaced apart from the main surface and configured to cover the first component, the first wire group and the second wire group.

10. The module according to claim 9 ,

wherein at least any wire of the first wire group and the second wire group is in contact with the shield film.

11. The module according to claim 2 , including a sealing resin configured to cover the first component, the second component and the three or more wires.

12. The module according to claim 1 ,

wherein the first component is a low noise amplifier.

13. The module according to claim 2 , including a second wire group arranged in a direction different from the first wire group and constituted of three or more wires disposed in parallel with each other that are bonded to the main surface so as to straddle the first component.

14. The module according to claim 4 ,

wherein the three or more wires of the first wire group and the three or more wires of the second wire group are orthogonal to each other.

15. A module comprising:

a substrate having a main surface;

a first component mounted on the main surface; and

a first wire group constituted of three or more wires disposed in parallel with each other that are bonded to the main surface such that each wire of the first wire group extends over and straddles the first component while extending in a first direction, wherein the first direction obliquely intersects with a longitudinal direction of the first component,

wherein when sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2019
From: OTSUBO, YOSHIHITO; KUSUNOKI, MOTOHIKO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 049887/0694 →
Priority Claims (2)
JP JP2018-146859 · Aug 3, 2018 · national
JP JP2019-090887 · May 13, 2019 · national
Continuity (1)
Related Publication 20200043865A1 · Feb 6, 2020