Semiconductor image sensor module and method of manufacturing the same
A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.
1. A light detecting device, comprising:
a first region including a plurality of photodiodes;
a second region including a plurality of pixel transistors and a first pad; and
a third region including a plurality of analog to digital converters and a second pad, wherein the first pad and the second pad are bonded to one another,
a first photodiode of the plurality of photodiodes and a first pixel transistor of the plurality of pixel transistors are electrically connected to one another through a conductor,
the first pixel transistor and a first analog to digital converter of the plurality of analog to digital converters are electrically connected to one another through the first pad and the second pad, and
the first region, the second region, and the third region are stacked and electrically connected to one another.
2. The light detecting device according to claim 1 , wherein a first side of the first region is a light incident side, and a second side of the first region opposite the first side is connected to a first side of the second region.
3. The light detecting device according to claim 2 , wherein the second side of the first region is bonded to the first side of the second region with an adhesive material.
4. The light detecting device according to claim 2 , wherein the first pad is disposed on a second side of the second region opposite the first side.
5. The light detecting device according to claim 1 , wherein the plurality of analog to digital converters are arranged in an array.
6. The light detecting device according to claim 5 , wherein the plurality of pixels are grouped in a plurality of pixel array units, and wherein a respective analog to digital converter corresponds to a corresponding pixel array unit.
7. The light detecting device according to claim 1 , wherein the plurality of analog to digital converters respectively include a comparator and a counter.
8. The light detecting device according to claim 1 , further comprising a fourth region including a plurality of memory elements, wherein the fourth region is stacked over the third region.
9. The light detecting device according to claim 8 , wherein the plurality of memory elements are volatile memories.
10. The light detecting device according to claim 1 , wherein the plurality of pixel transistors include a transfer transistor, a reset transistor, an amplifier transistor, and a select transistor.
11. An electronic apparatus, comprising:
an optical system; and
a light detecting device, the light detecting device including:
a first region including a plurality of photodiodes,
a second region including a plurality of pixel transistors and a first pad, and
a third region including a plurality of analog to digital converters and a second pad, wherein
the first pad and the second pad are bonded to one another,
a first photodiode of the plurality of photodiodes and a first pixel transistor of the plurality of pixel transistors are electrically connected to one another through a conductor,
the first pixel transistor and a first analog to digital converter of the plurality of analog to digital converters are electrically connected to one another through the first pad and the second pad,
the first region, the second region, and the third region are stacked and electrically connected to one another.
12. The electronic apparatus according to claim 11 , wherein a first side of the first region is a light incident side, and a second side of the first region opposite the first side is connected to a first side of the second region.
13. The electronic apparatus according to claim 12 , wherein the second side of the first region is bonded to the first side of the second region with an adhesive material.
14. The electronic apparatus according to claim 12 , wherein the first pad is disposed on a second side of the second region opposite the first side.
15. The electronic apparatus according to claim 11 , wherein the plurality of analog to digital converters are arranged in an array.
16. The electronic apparatus according to claim 15 , wherein the plurality of pixels are grouped in a plurality of pixel array units, and wherein a respective analog to digital converter corresponds to a corresponding pixel array unit.
17. The electronic apparatus according to claim 11 , wherein the plurality of analog to digital converters respectively include a comparator and a counter.
18. The electronic apparatus according to claim 11 , wherein the light detecting device further includes a fourth region including a plurality of memory elements, wherein the fourth region is stacked over the third region.
19. The electronic apparatus according to claim 18 , wherein the plurality of memory elements are volatile memories.
20. The electronic apparatus according to claim 11 , wherein the plurality of pixel transistors include a transfer transistor, a reset transistor, an amplifier transistor, and a select transistor.