IP Library › Granted Patent US 11,232,912
Granted Patent B2
US 11,232,912 · App. 16/815,253 · Granted Jan 25, 2022

Solid electrolytic capacitor

Inventors: Takeshi Furukawa (Nagaokakyo, JP); Yasuhiro Tamatani (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01G9/048H01G9/012H01G9/15H01G2009/05
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Quick Facts
Patent No.
US 11,232,912
App. No.
16/815,253
Granted
Jan 25, 2022
Kind
B2
Abstract

A solid electrolytic capacitor that includes a capacitor element laminate, a first external electrode, and a second external electrode. The capacitor element laminate includes capacitor elements, cathode lead-out layers, and a sealing body. At least one capacitor element includes an anode foil, dielectric layers, and cathode layers. The first external electrode is connected to the anode foil exposed at the first end surface of the capacitor element laminate. The second external electrode is connected to the cathode lead-out layers exposed at the second end surface of the capacitor element laminate. A first cathode lead-out layer and a second cathode lead-out layer are both conductive paste layers, and uniformly extend from where the first cathode lead-out layer and the second cathode lead-out layer are disposed on the cathode layers to the second external electrode.

Claims (30)

1. A solid electrolytic capacitor comprising:

a capacitor element laminate having a first end surface and a second end surface, the capacitor element laminate having:

at least one capacitor element that includes an anode foil made of a valve-action metal and exposed at the first end surface of the capacitor element laminate, a first dielectric layer on a first surface of the anode foil, a second dielectric layer on a second surface of the anode foil opposite the first surface, a first cathode layer including a first solid electrolyte layer on the first dielectric layer, and a second cathode layer including a second solid electrolyte layer on the second dielectric layer,

a first cathode lead-out layer on an upper surface of the capacitor element, connected to the first cathode layer, and exposed at the second end surface of the capacitor element laminate; and

a second cathode lead-out layer on a lower surface of the capacitor element, connected to the second cathode layer, and exposed at the second end surface of the capacitor element laminate, wherein

the first cathode lead-out layer and the second cathode lead-out layer are both conductive paste layers, and uniformly extend from where the first cathode lead-out layer and the second cathode lead-out layer are disposed on connected to the first and second cathode layers, respectively, to the second external electrode, and

the first cathode lead-out layer and the second cathode lead-out layer exposed at the second end surface of the capacitor element laminate are insulated from the anode foil; and

a sealing body enclosing the at least one capacitor element and the first and second cathode lead-out layers;

a first external electrode connected to the anode foil that is exposed at the first end surface of the capacitor element laminate; and

a second external electrode connected to the first and second cathode lead-out layers that are exposed at the second end surface of the capacitor element laminate.

2. The solid electrolytic capacitor according to claim 1 ,

wherein a metal foil exposed at the second end surface of the capacitor element laminate is in a space between the first cathode lead-out layer and the second cathode lead-out layer where the at least one capacitor element is not present, and

the metal foil is a portion separated from the anode foil by a slit, and is completely insulated from the anode foil.

3. The solid electrolytic capacitor according to claim 2 , further comprising:

an insulating portion filling the slit between the metal foil and the anode foil.

4. The solid electrolytic capacitor according to claim 3 , wherein the insulating portion extends to at least one of the first surface and the second surface of the anode foil.

5. The solid electrolytic capacitor according to claim 4 , further comprising:

an insulating layer between the at least one of the first surface and the second surface of the anode foil and the insulating portion extending to the at least one of the first surface and the second surface of the anode foil.

6. The solid electrolytic capacitor according to claim 1 , wherein the sealing body includes a resin molded body.

7. The solid electrolytic capacitor according to claim 6 , wherein the sealing body further includes a support board.

8. The solid electrolytic capacitor according to claim 6 , further comprising:

an insulating layer in a space between the first cathode lead-out layer and the second cathode lead-out layer where the at least one capacitor element is not present,

wherein the insulating layer and the resin molded body are made of different insulating materials.

9. The solid electrolytic capacitor according to claim 6 , further comprising:

an insulating layer in a space between the first cathode lead-out layer and the second cathode lead-out layer where the at least one capacitor element is not present,

wherein the insulating layer and the resin molded body are made of the same insulating material.

10. The solid electrolytic capacitor according to claim 1 , wherein the first solid electrolyte layer is on a surface of the first dielectric layer, the second solid electrolyte layer is on a surface of the second dielectric layer, the first cathode layer further includes a first carbon layer on a surface of the first solid electrolyte layer, and the second cathode layer further includes a second carbon layer on a surface of the second solid electrolyte layer.

11. The solid electrolytic capacitor according to claim 1 , wherein the anode foil is made of a valve-action metal selected from aluminum, tantalum, niobium, titanium, zirconium, and alloys thereof.

12. The solid electrolytic capacitor according to claim 1 , wherein the conductive paste layers contain silver, copper, or nickel.

13. The solid electrolytic capacitor according to claim 1 , wherein the conductive paste layers have a thickness of 2 μm to 20 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2020
From: FURUKAWA, TAKESHI; TAMATANI, YASUHIRO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 052081/0908 →
Priority Claims (1)
JP JP2019-054614 · Mar 22, 2019 · national
Continuity (1)
Related Publication 20200303130A1 · Sep 24, 2020