Corrosion preventive heatsink for network device
In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
1. An apparatus comprising:
a chassis base;
a printed circuit board mounted on the chassis base;
a heatsink positioned over the printed circuit board to prevent corrosion of the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls;
a seal interposed between an edge of the downward extending walls and the chassis base;
a fan positioned on the chassis base for generating airflow across the fins of the heatsink; and
a chassis cover extending over the heatsink.
2. The apparatus of claim 1 wherein the heatsink and the chassis base define sealed cavities above the printed circuit board and below the printed circuit board.
3. The apparatus of claim 1 wherein an inner edge of the heatsink defines a shoulder engaged with an upper side of the printed circuit board.
4. The apparatus of claim 1 further comprising a thermal pad interposed between an internal surface of the heatsink and a chip mounted on the printed circuit board.
5. The apparatus of claim 1 wherein the heatsink generally extends along an entire width of the chassis base.
6. The apparatus of claim 1 further comprising power components mounted on the chassis base adjacent to the heatsink.
7. The apparatus of claim 1 wherein the seal comprises a U-shaped gasket comprising one or more sealing elements.
8. An apparatus comprising:
a chassis base;
a printed circuit board mounted on the chassis base;
a heatsink positioned over the printed circuit board to prevent corrosion of the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls;
a seal interposed between an edge of the downward extending walls and the chassis base; and
a chassis cover extending over the heatsink;
wherein a front edge of the heatsink is in direct contact with an optical module port.
9. An apparatus comprising:
a chassis base;
a printed circuit board mounted on the chassis base;
a plurality of fans mounted on the chassis base; and
a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of fins positioned to allow airflow generated by the fans to flow across the fins;
wherein the heatsink and the chassis base define sealed cavities above the printed circuit board and below the printed circuit board.
10. The apparatus of claim 9 wherein the fans are stopped below a specified temperature within the chassis in which the heatsink provides sufficient cooling.
11. The apparatus of claim 9 wherein the fans operate at a reduced revolution per minute based on cooling provided by the heatsink.
12. The apparatus of claim 9 wherein the heatsink comprises a plurality of downward extending walls and a seal interposed between an edge of the downward extending walls and the chassis base.
13. The apparatus of claim 9 wherein an inner edge of the heatsink defines a shoulder engaged with an upper side of the printed circuit board.
14. An apparatus comprising:
a chassis base;
a printed circuit board mounted on the chassis base;
a plurality of fans mounted on the chassis base;
a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of fins positioned to allow airflow generated by the fans to flow across the fins; and
a thermal pad interposed between an internal surface of the heatsink and a chip mounted on the printed circuit board.
15. The apparatus of claim 9 wherein the heatsink generally extends along an entire width of the chassis base.
16. An apparatus comprising:
a chassis base;
a printed circuit board mounted on the chassis base;
an optical module cage mounted on the printed circuit board;
a heatsink positioned over the printed circuit board, wherein the heatsink comprises:
a rear wall and side walls for creating a seal with the chassis base; and
a front opening for receiving the optical module cage mounted on the printed circuit board, wherein an internal surface of the heatsink engages with the optical module cage to enclose a sealed cavity defined by the heatsink and chassis base; and
a fan mounted on the chassis base for generating airflow over the heatsink;
wherein the heatsink is configured to protect the printed circuit board from corrosion and provide cooling to the printed circuit board and an optical module inserted into the optical module cage.
17. The apparatus of claim 16 wherein the seal further comprises a gasket interposed between the walls of the heatsink and the chassis base.
18. The apparatus of claim 16 wherein the fans are stopped below a specified temperature within the chassis in which the heatsink provides sufficient cooling.
19. The apparatus of claim 16 further comprising a thermal pad interposed between the internal surface of the heatsink and a chip mounted on the printed circuit board.
20. The apparatus of claim 16 further comprising power components mounted on the chassis base adjacent to the heatsink and wherein the fan is mounted adjacent to the heatsink.