IP Library › Granted Patent US 11,236,257
Granted Patent B2
US 11,236,257 · App. 16/013,198 · Granted Feb 1, 2022

Moisture-curable hot melt adhesive

Inventors: Kenji Matsuda (Osaka, JP); Ai Takamori (Osaka, JP); Tsuyoshi Tamogami (Osaka, JP)
Assignee: Henkel AG & Co. KGaA
C09J175/08B32B7/12B32B13/08B32B13/10B32B13/12B32B21/02B32B21/04B32B21/06B32B21/08B32B21/13B32B21/14B32B27/06B32B27/08B32B27/10B32B27/302B32B27/304B32B27/32B32B27/36B32B27/365B32B27/40B32B29/002C08G18/4018C08G18/4202C08G18/4213C08G18/4854C08G18/7671C08G65/2615C08L23/02C08L23/04C08L23/10C08L25/16C08L29/04C08L75/04C09J125/16C09J173/00C09J175/04B32B2250/02B32B2250/24B32B2255/08B32B2255/10B32B2255/12B32B2255/26B32B2307/402B32B2307/41B32B2307/412B32B2307/548B32B2307/58B32B2419/00B32B2419/04B32B2451/00B32B2457/00B32B2479/00B32B2605/00C08G2170/20
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Quick Facts
Patent No.
US 11,236,257
App. No.
16/013,198
Granted
Feb 1, 2022
Kind
B2
Abstract

The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.

Claims (30)

1. A moisture-curable hot melt adhesive comprising, based on 100 parts by total weight of adhesive:

(A) 20 to 50 parts by weight of a urethane prepolymer having a terminal isocyanate group, the urethane prepolymer being a reaction product of a mixture comprising a polyisocyanate, a polyether polyol and a polyester polyol,

(B) 2 to 15 parts by weight of a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C., and

(C) 2 to 20 parts by weight of a polyester-polyether block copolymer comprising a polybutylene terephthalate segment; and a segment selected from polytetramethylene glycol, and

(D) 4 to 12 parts by weight of an ethylene/carboxylic acid ester copolymer comprising an ethylene vinyl acetate copolymer.

2. The moisture-curable hot melt adhesive according to the above claim 1 , wherein the content of vinyl acetate in the ethylene/vinyl acetate copolymer is 20 to 50% by weight.

3. The moisture-curable hot melt adhesive according to the above claim 1 , wherein the melt flow rate of the ethylene/vinyl acetate copolymer (D) is 20 to 200 g/10 min at 190° C., 2.16 kg.

4. The moisture-curable hot melt adhesive according to claim 1 , further comprising (E) an α-methyl styrene-based resin.

5. The moisture-curable hot melt adhesive according to claim 4 , comprising 2 to 15 parts by weight of the metallocene-based polyolefin (B) based on 100 parts by weight of a total weight of (A), (B), (C) and (E).

6. A laminate comprising the moisture-curable hot melt adhesive according to claim 1 .

7. Cured reaction products of the moisture-curable hot melt adhesive according to claim 1 .

8. A method for producing a moisture-curable hot melt adhesive according to claim 1 comprising:

reacting a polyol and an isocyanate compound to form (A) a urethane prepolymer having a terminal isocyanate group;

providing (B) a metallocene-based polyolefin, (C) a polyester-polyether copolymer, (D) an ethylene/carboxylic acid ester copolymer, and (E) an α-methyl styrene-based resin; and

mixing the (A) a urethane prepolymer, (B) the metallocene-based polyolefin, (C) the polyester-polyether copolymer, (D) the ethylene/carboxylic acid ester copolymer, and (E) the α-methyl styrene-based resin to form the moisture-curable hot melt adhesive.

9. The moisture-curable hot melt adhesive according to claim 1 , wherein the ethylene/carboxylic acid ester copolymer (D) comprises an ethylene-C 1-10 alkyl (meth)acrylate copolymer.

10. The moisture-curable hot melt adhesive according to claim 1 , wherein the ethylene/carboxylic acid ester copolymer (D) comprises the ethylene/vinyl acetate copolymer and an ethylene-C 1-10 alkyl (meth)acrylate copolymer.

11. The moisture-curable hot melt adhesive according to claim 1 , comprising:

30 to 40 parts by weight of the (A) urethane prepolymer;

4 to 12 parts by weight of the (B) metallocene-based polyolefin;

5 to 15 parts by weight of the (C) polyester-polyether copolymer;

wherein the total weight of all components in the moisture curable hot melt adhesive is 100.

12. A moisture-curable hot melt adhesive comprising, based on 100 parts by total weight of adhesive:

(A) 20 to 50 parts by weight of a urethane prepolymer having a terminal isocyanate group, the urethane prepolymer being a reaction product of a mixture comprising a polyisocyanate, a polyether polyol and a polyester polyol,

(B) 2 to 15 parts by weight of a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C., and

(C) to 20 parts by weight of a polyester-polyether copolymer having a chemical structure comprising

wherein n denotes an integer and is preferably 20 to 1,000; and

wherein p is an integer of 2 to 5, q is an integer of 2 to 200, and m is an integer of 1 to 200, and

(D) 4 to 12 parts by weight of an ethylene/carboxylic acid ester copolymer.

13. The moisture-curable hot melt adhesive according to claim 1 , wherein the urethane prepolymer mixture comprises an amount of the polyether polyol and a greater amount of polyester polyol, the amounts in parts by weight of the mixture.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2018
From: MATSUDA, KENJI; TAKAMORI, AI; TAMOGAMI, TSUYOSHI
To: HENKEL AG & CO. KGAA
Reel/Frame 047828/0209 →
Priority Claims (1)
JP JP2015-254365 · Dec 25, 2015 · national
Continuity (2)
Continuation PCTJP2016087917 · Dec 20, 2016
Related Publication 20180298254A1 · Oct 18, 2018