Wafer supply device
A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.
1. A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device comprising:
a die information storage section configured to store a number of the dies for each rank allocated to each of the dies;
a block information acquisition section configured to acquire a condition of the dies to be mounted on a block provided on a board to be conveyed;
a required block number acquisition section configured to acquire a required number of the dies to be mounted on the block; and
a producible number calculation section configured to calculate a number of producible blocks based on a content stored in the die information storage section and a content which is acquired by the block information acquisition section and the required block number acquisition section;
a spare setting section configured to set a part of the dies stored in the wafer supply device as spare dies to be used for recovery, for each rank; and
a control section configured to populate the board based on the calculated number of producible blocks,
wherein the producible number calculation section calculates a producible number of the blocks in a state where the number of the spare dies set for each rank by the spare setting section is subtracted from a total number of the dies, for each rank stored in the wafer supply device.
2. The wafer supply device according to claim 1 , further comprising:
a producible number display section configured to display a result calculated by the producible number calculation section.
3. The wafer supply device according to claim 1 , further comprising:
a scheduled number acquisition section configured to acquire a scheduled production number of the blocks;
a lot information storage section configured to store a number of the dies included in a lot having of one wafer or multiple wafers for each rank, and
a production propriety determining section configured to determine whether the lot stored in the lot information storage section includes dies sufficient to produce the scheduled production number of the blocks acquired by the scheduled number acquisition section.
4. The wafer supply device according to claim 3 , further comprising:
a production propriety display section configured to display a determination result by the production propriety determining section.
5. The wafer supply device according to claim 4 , further comprising:
a lot selection section configured to select the lot having a number of dies remaining at the end of production when there are multiple lots including the dies sufficient to produce the scheduled production number of the blocks acquired by the scheduled number acquisition section among the lots stored in the lot information storage section.
6. The wafer supply device according to claim 5 , further comprising:
an optimum lot display section configured to display the lot selected by the lot selection section as an optimum lot.