Electroluminance lighting device having high aperture ratio

1. An electroluminescent lighting device, comprising:

a substrate including an emission area and a non-emission area adjacent to the emission area;

power lines disposed in the emission area and forming a plurality of open areas;

a buffer layer covering the power lines;

an emission element disposed in each of the open area on the buffer layer;

a link electrode overlapping the power lines on the buffer layer, and having a first end connected to the emission element and a second end connected to one of the power lines;

a passivation layer deposited within a width of the power line covering the link electrode;

an emission layer covering the emission area; and

a cathode layer covering the emission area on the emission layer.

2. The device according to claim 1 , wherein the power lines are arranged in a mesh shape to form the open area therebetween; and

wherein the open area has a polygon shape and is separated from neighboring open area with a predetermined distance corresponding to the width of the power line.

3. The device according to the claim 1 , wherein the emission element includes:

a first electrode larger than the open area;

the emission layer deposited on the first electrode; and

a second electrode formed by the open area among areas of the cathode layer.

4. The device according to claim 3 , wherein the link electrode has a segment shape overlapping a middle portion of the power line;

wherein the first end is extended from the first electrode; and

wherein the second end is connected to the power line through a pixel contact hole penetrating the buffer layer.

5. The device according to claim 4 , wherein the passivation layer covers whole of the link electrode and the pixel contact hole under the emission layer, and covers a circumference of the first electrode.

6. The device according to claim 5 , wherein the passivation layer has a boundary disposed between the circumference of the first electrode and a circumference of the open area, and exposes the open area.

7. The device according to claim 1 , further comprising:

a routing line connected to the power line, and disposed at the non-emission area as surrounding the emission area;

a first pad disposed at one side of the non-emission area and connected to the routing line; and

a second pad disposed at another side of the non-emission area and as being separated from the routing line, and having an end connected to the cathode layer.

8. The device according to claim 7 , wherein the cathode layer is formed on the buffer layer covering the end of the second pad, and connected to the second pad through a pad contact hole exposing the end of the second pad.

9. The device according to claim 1 , further comprising:

an encapsulation layer covering the emission area having the emission element;

a cover film disposed on the encapsulation layer; and

an adhesive attaching the encapsulation to the cover film.

10. The device according to claim 7 , further comprising:

a light extracting layer on the substrate;

wherein the routing line and the power line is disposed on the light extracting layer.

11. The device according to claim 10 , wherein the first pad, the second pad, the routing line, and the power line is made of a same metal material.

12. The device according to claim 11 , wherein the metal material includes copper.

13. The device according to claim 7 , further comprising:

a buffer layer on the light extracting layer;

wherein the routing line and the power line is disposed on the buffer layer.