Semiconductor device and method for fabricating the same
A semiconductor device includes a substrate including an active region and a dummy active region that are spaced apart by an isolation layer, a buried word line extending from the active region to the dummy active region, and a contact plug coupled to an edge portion of the buried word line, wherein an upper surface of the active region is positioned at a higher level than an upper surface of the buried word line, and an upper surface of the dummy active region is positioned at a lower level than the upper surface of the buried word line.
1. A semiconductor device, comprising:
a substrate including an active region and a dummy active region that are spaced apart by an isolation layer;
a buried word line extending from the active region to the dummy active region; and
a contact plug coupled to an edge portion of the buried word line,
wherein an upper surface of the active region is positioned at a higher level than an upper surface of the buried word line,
wherein an upper surface of the dummy active region is positioned at a lower level than the upper surface of the buried word line, and
wherein the dummy active region has a shape that extends longer than the active region.
2. The semiconductor device of claim 1 , wherein the edge portion of the buried word line includes a buried portion buried in the dummy active region; and a protruding portion formed over the buried portion, and
wherein an upper surface of the protruding portion is positioned at a higher level than the upper surface of the dummy active region.
3. The semiconductor device of claim 2 , further comprising:
a capping layer covering sidewalls and an upper surface of the protruding portion; and
a contact plug coupled to the upper surface of the protruding portion through the capping layer.
4. The semiconductor device of claim 3 , wherein the bottom portion of the contact plug includes
a first portion overlapping with an edge portion of the buried word line; and
a second portion overlapping with the capping layer.
5. The semiconductor device of claim 4 , wherein the second portion of the contact plug extends to overlap with one sidewall of the protruding portion of the buried word line.
6. The semiconductor device of claim 3 , wherein the capping layer extends to cover an upper surface of the isolation layer.
7. The semiconductor device of claim 3 , wherein the capping layer includes silicon nitride.
8. The semiconductor device of claim 1 , wherein the buried word line includes a metal-based material, a doped semiconductor material, a metal nitride, a metal, or a combination thereof.
9. The semiconductor device of claim 1 , wherein the edge portion of the buried word line includes a metal-based material, and the buried word line includes the metal-based material and a semiconductor material over the metal-based material.
10. The semiconductor device of claim 1 , wherein a width of the contact plug is greater than a width of the edge portion of the buried word line.
11. A semiconductor device, comprising:
a substrate including a plurality of active regions and a plurality of dummy active regions that are spaced apart by an isolation layer;
a plurality of buried word lines that are buried in the substrate and extend from the active regions to the dummy active regions;
a capping layer that covers an edge portion of each of the buried word lines; and
a contact plug coupled to the edge portion of each of the buried word lines,
wherein the edge portion of each of the buried word lines includes
a buried portion buried in the dummy active regions; and
a protruding portion formed over the buried portion and having a higher level than an upper surface of a dummy active region.
12. The semiconductor device of claim 11 , wherein the capping layer covers sidewalls and an upper surface of the protruding portion.
13. The semiconductor device of claim 11 , wherein the bottom portion of the contact plug includes
a first portion overlapping with an edge portion of each of the buried word lines; and
a second portion overlapping with the capping layer.
14. The semiconductor device of claim 13 , wherein the second portion of the contact plug extends to overlap with one sidewall of the protruding portion of each of the buried word lines.
15. The semiconductor device of claim 11 , wherein the capping layer extends to cover an upper surface of the isolation layer.
16. The semiconductor device of claim 11 , wherein the capping layer includes silicon nitride.
17. The semiconductor device of claim 11 , wherein the edge portion of each of the buried word lines includes a metal-based material, and the buried word lines include the metal-based material and a semiconductor material over the metal-based material.
18. The semiconductor device of claim 11 , wherein the capping layer covers upper portions of the buried word lines, and the capping layer is buried in the substrate and extends from the active regions to the dummy active regions.
19. The semiconductor device of claim 11 , wherein a width of the contact plug is greater than a width of the edge portion of each of the buried word lines.
20. The semiconductor device of claim 11 , further comprising:
a bit line structure positioned at a higher level than the buried word lines while crossing the buried word lines;
a capacitor positioned at a higher level than the bit line structure while coupled to a portion of the active region.
21. A semiconductor device, comprising:
an active region and a dummy active region separated by an isolation layer, the dummy active region having an upper surface that is positioned lower than an upper surface of the active region; and
a buried word line extending from the active region to the dummy active region,
wherein the buried word line is fully buried within the active region and only partially buried in the dummy active region.