IP Library › Granted Patent US 11,245,357
Granted Patent B2
US 11,245,357 · App. 17/081,268 · Granted Feb 8, 2022

Vibration device

Inventor: Junichi Takeuchi (Chino, JP)
Assignee: SEIKO EPSON CORPORATION
H03B5/04H01L23/345H03B5/36H03H9/02102H03H9/0557H03H9/08H03H9/1021
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Quick Facts
Patent No.
US 11,245,357
App. No.
17/081,268
Granted
Feb 8, 2022
Kind
B2
Abstract

A vibration device has a substrate including a first surface and a second surface located on an opposite side to the first surface, a heater provided on the first surface side of the substrate, a temperature sensor provided on the first surface side of the substrate, a vibration element disposed on the first surface side of the substrate, a lid including a third surface joined on the first surface side and a fourth surface located on an opposite side to the third surface, and a circuit provided on one of the first surface, the second surface and the fourth surface, and including a temperature control circuit configured to control the heater based on an output of the temperature sensor.

Claims (28)

1. A vibration device comprising:

a substrate provided with a first surface and a second surface located on an opposite side to the first surface;

a heater provided on the first surface side of the substrate;

a temperature sensor provided on the first surface side of the substrate;

a vibration element disposed on the first surface side of the substrate;

a lid provided with a third surface joined on the first surface side, and a fourth surface located on an opposite side to the third surface; and

a circuit provided on the fourth surface and including a temperature control circuit configured to control the heater based on an output of the temperature sensor,

wherein the lid has a first through electrode passing through the third surface and the fourth surface, and electrically connecting the heater and the circuit, and a second through electrode passing through the third surface and the fourth surface, and electrically connecting the temperature sensor and the circuit.

2. The vibration device according to claim 1 ,

wherein the circuit has an oscillation circuit, and

the lid has a third through electrode passing through the third surface and the fourth surface, and electrically connecting the vibration element and the circuit.

3. The vibration device according to claim 1 , comprising:

an insulating layer provided on the fourth surface side of the lid, and covering the circuit.

4. A vibration device comprising:

a substrate provided with a first surface and a second surface located on an opposite side to the first surface;

a heater provided on the first surface side of the substrate;

a temperature sensor provided on the first surface side of the substrate;

a vibration element disposed on the first surface side of the substrate;

a lid provided with a third surface joined on the first surface side, and a fourth surface located on an opposite side to the third surface; and

a circuit provided on the second surface and including a temperature control circuit configured to control the heater based on an output of the temperature sensor,

wherein the substrate has a first through electrode passing through the first surface and the second surface, and electrically connecting the heater and the circuit, and a second through electrode passing through the first surface and the second surface, and electrically connecting the temperature sensor and the circuit.

5. The vibration device according to claim 4 ,

wherein the circuit has an oscillation circuit, and

the substrate has a third through electrode passing through the first surface and the second surface, and electrically connecting the vibration element and the circuit.

6. The vibration device according to claim 4 , comprising:

an insulating layer provided on the second surface side of the substrate, and covering the circuit.

7. The vibration device according to claim 2 ,

wherein the circuit includes a temperature compensation circuit configured to perform temperature compensation of an oscillation signal from the oscillation circuit based on the output of the temperature sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2020
From: TAKEUCHI, JUNICHI
To: SEIKO EPSON CORPORATION
Reel/Frame 054182/0608 →
Priority Claims (1)
JP JP2019-196697 · Oct 29, 2019 · national
Continuity (1)
Related Publication 20210126583A1 · Apr 29, 2021