IP Library Granted Patent US 11,251,307
Granted Patent B2
US 11,251,307 · App. 16/120,705 · Granted Feb 15, 2022

Device comprising 2D material

Inventors: Tae-jin Park (Yongin-si, KR); Jin-bum Kim (Seoul, KR); Bong-soo Kim (Yongin-si, KR); Kyu-pil Lee (Seongnam-si, KR); Hyeong-sun Hong (Seongnam-si, KR); Yoo-sang Hwang (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01L29/78603H01L21/02612H01L29/0665H01L29/1606H01L29/4236H01L29/42384H01L29/66969H01L29/66977H01L29/778H01L29/7788H01L29/7789H01L29/7853H01L29/78606H01L29/78642H01L29/78696H01L29/86H01L29/88H01L21/02488H01L21/02494H01L21/02568H01L21/02614H01L29/24H01L29/66045
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Quick Facts
Patent No.
US 11,251,307
App. No.
16/120,705
Granted
Feb 15, 2022
Kind
B2
Abstract

A device includes a substrate, a first electrode on the substrate, an insulating pattern on the substrate, a second electrode on an upper end of the insulating pattern, a two-dimensional (2D) material layer on a side surface of the insulating pattern, a gate insulating layer covering the 2D material layer, and a gate electrode contacting the gate insulting layer. The insulating pattern extends from the first electrode in a direction substantially vertical to the substrate. The 2D material layer includes at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern.

Claims (58)

1. A device comprising:

a substrate;

a first electrode on the substrate;

an insulating pattern on the substrate, the insulating pattern extending from the first electrode in a direction substantially vertical to the substrate;

a second electrode on an upper end of the insulating pattern;

a 2D material layer along a side surface of the insulating pattern, the 2D material layer including at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern,

a transition metal element in the insulating pattern being the same as a transition metal element in the 2D material layer, the transition metal element being molybdenum (Mo) or tungsten (W);

a gate insulating layer covering the 2D material layer; and

a gate electrode contacting the gate insulating layer.

2. The device of claim 1 , wherein the 2D material layer includes a transition metal dichalcogenide.

3. The device of claim 1 , wherein the insulating pattern includes a transition metal dioxide.

4. The device of claim 1 , wherein

the insulating pattern includes molybdenum dioxide, and

the 2D material includes a molybdenum chalcogenide.

5. The device of claim 1 , wherein

the side surface of the insulating pattern is substantially vertical to the substrate, and

the at least one atomic layer of the 2D material is substantially vertical to the substrate.

6. The device of claim 1 , wherein the gate insulating layer contacts the first electrode and the second electrode.

7. The device of claim 1 , wherein the 2D material layer extends from the first electrode to the second electrode in the direction substantially vertical to the substrate along the side surface of the insulating pattern.

8. The device of claim 1 , wherein the at least one atomic layer of the 2D material layer is substantially vertical to the substrate.

9. The device of claim 1 , wherein a cross-sectional area of the first electrode in a direction parallel to the substrate differs from a cross-sectional area of the second electrode in the direction parallel to the substrate.

10. The device of claim 1 , wherein the 2D material layer further includes a portion between the insulating pattern and the second electrode.

11. The device of claim 1 , wherein the gate electrode is an all-around gate electrode surrounding a circumference of the gate insulating layer.

12. The device of claim 1 , wherein the insulating pattern extends from a top surface of the first electrode in a direction substantially vertical to the substrate such that a bottom surface of the insulating pattern is on the top surface of the first electrode.

13. A device comprising:

a substrate;

a channel structure on the substrate,

the channel structure extending in a first direction that is parallel to the substrate,

the channel structure including an insulating pattern and a 2D material layer on a surface of the insulating pattern,

the 2D material layer including at least one atomic layer of a 2D material that is parallel to the surface of the insulating pattern, and

a transition metal element in the insulating pattern being the same as a transition metal element in the 2D material layer, the transition metal element being molybdenum (Mo) or tungsten (W);

a first electrode and a second electrode on the substrate, the first electrode and the second electrode respectively being located at both ends of the channel structure;

a gate electrode on the substrate, the gate electrode extending in a second direction that is parallel to the substrate, and the gate electrode intersecting the channel structure; and

a gate insulating layer between the channel structure and the gate electrode.

14. The device of claim 13 , wherein the gate insulating layer contacts a side surface of the channel structure and an upper surface of the channel structure.

15. The device of claim 13 , wherein

the 2D material layer includes a first portion and a second portion,

the first portion of the 2D material layer is on an upper surface of the insulating pattern, and

the second portion of the 2D material layer is on a side surface of the insulating pattern.

16. The device of claim 15 , wherein

inside the first portion of the 2D material layer, each of the at least one atomic layer is substantially parallel to the substrate, and inside the second portion of the 2D material layer, the at least one atomic layer is substantially vertical to the substrate.

17. The device of claim 13 , further comprising:

a device isolation film on the substrate, wherein

an upper surface of the insulating pattern and a portion of a side surface of the insulating pattern are not covered by the device isolation film, and

the 2D material layer is on the portion of the side surface of the insulating pattern that is not covered by the device isolation film, and

the 2D material layer is on the upper surface of the insulating pattern.

18. A device comprising:

a substrate;

an insulating pattern on the substrate;

one pair of 2D material layers on side surfaces of the insulating pattern,

each of the one pair of 2D material layers including at least one atomic layer of a 2D material that is parallel to the side surfaces of the insulating pattern, and

the one pair of 2D material layers including a first 2D material layer and a second 2D material layer spaced apart from each other in a first direction that is parallel to the substrate by interposing the insulating pattern therebetween;

a first electrode contacting the first 2D material layer and being spaced apart from the second 2D material layer; and

a second electrode contacting the second 2D material layer and being spaced apart from the first 2D material layer.

19. The device of claim 18 , wherein

a width of the first electrode in a second direction that is parallel to the substrate is substantially the same as a width of the insulating pattern in the second direction, and

the second direction crosses the first direction.

20. The device of claim 18 , wherein a height of the first electrode in a third direction that is vertical to the substrate is substantially the same as a height of the insulating pattern in the third direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2018
From: PARK, TAE-JIN; KIM, JIN-BUM; KIM, BONG-SOO; LEE, KYU-PIL; HONG, HYEONG-SUN; HWANG, YOO-SANG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046779/0234 →
Priority Claims (1)
KR 10-2017-0112493 · Sep 4, 2017 · national
Continuity (1)
Related Publication 20190074380A1 · Mar 7, 2019