Optical surface-mount devices
An optical surface-mount device has a dielectric body and a solderable support connected with the dielectric body to facilitate solder reflow mounting of the device to a printed circuit board. The device can include a reflector or other functional features that enhance or protect the functionality of an electronic component mounted on the same printed circuit board.
1. A surface-mount device comprising:
a dielectric body;
an optical component supported on or integrated onto the dielectric body; and
a solderable metal or metal alloy support clipped on to or embedded in the dielectric body and having solder pads offset from a bottom of the dielectric body to facilitate solder reflow mounting of the device to a printed circuit board.
2. The surface-mount device of claim 1 , wherein at least one through-hole is defined in the dielectric body.
3. The surface-mount device of claim 1 , wherein the dielectric body comprises a plastic material.
4. The surface-mount device of claim 1 , wherein the solderable support comprises an alloy of copper.
5. The surface-mount device of claim 1 , wherein the dielectric body and solderable support are snap-fit together.
6. The surface-mount device of claim 2 , wherein the through-hole defines a reflector for focusing light emitted from an LED positioned in the recess.
7. The surface-mount device of claim 6 , wherein surfaces of the reflector are provided with a metalized coating.
8. The surface-mount device of claim 1 , wherein the solderable metal support is a clip configured to resiliently engage features of the dielectric body.
9. The surface-mount device of claim 1 , wherein the solderable metal support is partially embedded in the dielectric body.
10. The surface-mount device of claim 1 , wherein the optical component is a reflector.
11. An electronic assembly, comprising:
a printed circuit board;
an electronic device mounted directly on the printed circuit board; and
a surface-mount device including a dielectric body defining at least one through-hole positioned over and around the electronic device, and including a solderable support connected with the dielectric body and soldered to the printed circuit board.
12. The assembly of claim 11 , wherein the electronic device is an LED, and the through-hole defines a reflector for focusing light from the LED.
13. The assembly of claim 12 , wherein a surface of the reflector is provided with a metalized coating.
14. The assembly of claim 11 , wherein the solderable metal support is a clip configured to resiliently engage features of the dielectric body.
15. The assembly of claim 11 , wherein the solderable metal support is partially embedded in the dielectric body.