Photoacoustic sensor module and assembly

1. An interconnect module for a photoacoustic sensor, comprising:

a support structure configured to be situated between an emitter module of the photoacoustic sensor and a detector module of the photoacoustic sensor,

wherein the emitter module includes an emitter component and the detector module includes a detector component, and

wherein the support structure, together with the emitter module and the detector module, form a cavity to receive a gas and to enable the gas to flow between the emitter module and the detector module; and

a conductive element configured to connect to at least one of the emitter component or the detector component.

2. The interconnect module of claim 1 , wherein the support structure is formed from at least one of:

a fiberglass epoxy resin material; or

a ceramic material.

3. The interconnect module of claim 1 , wherein the conductive element corresponds to a via formed within the support structure.

4. The interconnect module of claim 1 , wherein a first end of the conductive element is bonded to the emitter module and a second end of the conductive element is bonded to the detector module to cause the interconnect module to be connected to the emitter module and the detector module.

5. The interconnect module of claim 1 , wherein the interconnect module is configured to permit the detector module to detect a composition of the gas in the cavity based on the gas absorbing one or more light pulses emitted from the emitter module.

6. The interconnect module of claim 1 , wherein the support structure comprises:

a first frame configured to attach to the emitter module,

a second frame configured to attach to the detector module, and

one or more spacers between the first frame and the second frame,

wherein the one or more spacers are configured to form an opening between the first frame and the second frame.

7. The interconnect module of claim 1 , wherein the support structure comprises:

a first sidewall configured to attach to the emitter module and the detector module;

a second sidewall configured to attach to the emitter module and the detector module; and

one or more frames connected to the first sidewall and the second sidewall,

wherein the one or more frames are configured to form an opening between the first sidewall and the second sidewall.

8. The interconnect module of claim 1 , wherein the conductive element is configured to provide at least one of:

an electrical connection between the emitter component and a control component of the photoacoustic sensor,

an electrical connection between the detector component and the control component of the photoacoustic sensor, or

an electrical connection between the emitter component and the detector component.

9. The interconnect module of claim 1 , wherein the interconnect module is configured to be situated between the emitter module and the detector module by a surface mount technology (SMT) machine.

10. A photoacoustic sensor comprising:

an emitter module,

wherein the emitter module includes an emitter component configured to emit light pulses;

a detector module,

wherein the detector module includes a detector component configured to detect absorption of the light pulses by a gas; and

an interconnect module positioned between the emitter module and the detector module,

wherein the interconnect module comprises:

a support structure connecting the emitter module and the detector module,

wherein the support structure includes a conductive element to provide electrical connectivity to the emitter component or the detector component; and

wherein the support structure includes a cavity to enable the gas to flow within the interconnect module.

11. The photoacoustic sensor of claim 10 , wherein the interconnect module is formed from a different material than the emitter module, or the interconnect module is formed from a different material than the detector module.

12. The photoacoustic sensor of claim 10 , wherein a dimension of the cavity is based on a type of the gas.

13. The photoacoustic sensor of claim 10 , wherein the interconnect module, the emitter module, and the detector module are configured to be assembled as a photoacoustic module of the photoacoustic sensor using a surface mount technology (SMT) machine.

14. The photoacoustic sensor of claim 10 , further comprising:

a control module,

wherein the control module includes a control component to control at least one of the emitter component or the detector component.

15. The photoacoustic sensor of claim 14 , wherein the control module is mounted to at least one of:

the emitter module,

the detector module, or

the interconnect module.

16. The photoacoustic sensor of claim 14 , wherein the control module is mounted to a printed circuit board,

wherein at least one of the emitter module, the detector module, or the interconnect module are mounted to the printed circuit board,

wherein the printed circuit board provides at least one of:

a first electrical connection between the control component and the emitter component, or

a second electrical connection between the control component and the detector component.

17. The photoacoustic sensor of claim 16 , wherein the conductive element provides at least one of:

the first electrical connection, or

the second electrical connection.

18. A method, comprising:

attaching an interconnect module to a detector module,

wherein the detector module includes a detector component and the interconnect module includes a first conductive element configured to bond with the detector component; and

attaching an emitter module to the interconnect module opposite the detector module,

wherein the emitter module incudes an emitter component,

wherein the interconnect module includes a second conductive element configured to bond with the emitter component, and

wherein a cavity, formed between the detector module, the emitter module, and the interconnect module, is to receive a gas and to enable the gas to flow between the emitter module and the detector module.

19. The method of claim 18 , further comprising:

mounting at least one of the emitter module, the detector module, or the interconnect module to a printed circuit board.

20. The method of claim 18 , further comprising:

mounting the detector module to a printed circuit board,

wherein the interconnect module is attached to the detector module after the detector module is mounted to the printed circuit board and the emitter module is attached to the interconnect module after the detector module is mounted to the printed circuit board.