Semiconductor device and method of making

1. A method for forming a semiconductor device, comprising:

forming a first dielectric layer over a semiconductor layer;

forming a silicon nitride waveguide over the first dielectric layer;

forming a second dielectric layer over the silicon nitride waveguide;

forming a substrate over the second dielectric layer;

performing an inversion operation such that the substrate is a bottommost layer of the semiconductor device;

removing one or more layers over the semiconductor layer to expose the semiconductor layer;

patterning the semiconductor layer, after the semiconductor layer is exposed, to form a semiconductor waveguide overlying the silicon nitride waveguide, wherein patterning the semiconductor layer exposes a top surface of the first dielectric layer; and

forming a third dielectric layer over the top surface of the first dielectric layer, wherein a bottom surface of the semiconductor waveguide is adjacent to the first dielectric layer, a first sidewall of the semiconductor waveguide is adjacent to the third dielectric layer, and a second sidewall of the semiconductor waveguide is adjacent to the third dielectric layer.

2. The method of claim 1 , comprising:

after forming the silicon nitride waveguide and prior to forming the second dielectric layer, annealing the silicon nitride waveguide.

3. The method of claim 1 , wherein forming the silicon nitride waveguide comprises:

forming a silicon nitride layer over the first dielectric layer; and

patterning the silicon nitride layer.

4. The method of claim 3 , comprising:

after forming the silicon nitride layer, annealing the silicon nitride layer.

5. The method of claim 1 , comprising:

forming a fourth dielectric layer over the third dielectric layer;

forming a first conductive structure in the fourth dielectric layer, wherein the first conductive structure is in contact with a modulator structure in the third dielectric layer;

forming a fifth dielectric layer over the fourth dielectric layer; and

forming a second conductive structure in the fifth dielectric layer, wherein the second conductive structure is in contact with the first conductive structure.

6. A method for forming a semiconductor device, comprising:

forming a first dielectric layer over a first substrate;

forming a silicon nitride waveguide over the first dielectric layer;

forming a second dielectric layer over the silicon nitride waveguide;

forming a composite over the second dielectric layer, wherein the composite comprises a semiconductor layer and one or more layers over the semiconductor layer;

removing the one or more layers to expose the semiconductor layer;

patterning the semiconductor layer, after the semiconductor layer is exposed, to form a semiconductor waveguide over the silicon nitride waveguide, wherein patterning the semiconductor layer exposes a top surface of the second dielectric layer; and

forming a third dielectric layer over the top surface of the second dielectric layer, wherein a bottom surface of semiconductor waveguide is adjacent to the second dielectric layer, a first sidewall of the semiconductor waveguide is adjacent to the third dielectric layer, and a second sidewall of the semiconductor waveguide is adjacent to the third dielectric layer.

7. The method of claim 6 , wherein removing the one or more layers comprises:

removing a second substrate over a third dielectric layer, wherein the third dielectric layer is over the semiconductor layer; and

removing the third dielectric layer.

8. The method of claim 6 , comprising:

after forming the silicon nitride waveguide and prior to the forming the second dielectric layer, annealing the silicon nitride waveguide.

9. The method of claim 6 , wherein forming the silicon nitride waveguide comprises:

forming a silicon nitride layer over the first dielectric layer; and

patterning the silicon nitride layer.

10. The method of claim 6 , comprising:

forming a fourth dielectric layer over the third dielectric layer;

forming a first conductive structure in the fourth dielectric layer, wherein the first conductive structure is in contact with a modulator structure in the third dielectric layer;

forming a fifth dielectric layer over the fourth dielectric layer; and

forming a second conductive structure in the fifth dielectric layer, wherein the second conductive structure is in contact with the first conductive structure.

11. A method for forming a semiconductor device, comprising:

forming a semiconductor layer;

forming a first dielectric layer over the semiconductor layer;

forming a silicon nitride layer over the first dielectric layer;

patterning the silicon nitride layer to define a silicon nitride waveguide;

performing an inversion operation such that the semiconductor layer is over the first dielectric layer;

patterning the semiconductor layer after performing the inversion operation to define a semiconductor waveguide; and

forming a second dielectric layer over the semiconductor waveguide, wherein the second dielectric layer contacts the first dielectric layer, a first sidewall of the semiconductor waveguide, and a second sidewall of the semiconductor waveguide.

12. The method of claim 11 , comprising:

forming a third dielectric layer over the silicon nitride waveguide prior to performing the inversion operation.

13. The method of claim 11 , wherein patterning the semiconductor layer comprises patterning the semiconductor layer to define a modulator structure.

14. The method of claim 13 , wherein the semiconductor waveguide is separated from the modulator structure by the second dielectric layer.

15. The method of claim 11 , wherein:

forming the first dielectric layer comprises forming the first dielectric layer to contact the semiconductor layer, and

forming the silicon nitride layer comprises forming the silicon nitride layer to contact the first dielectric layer.

16. The method of claim 11 , wherein the semiconductor layer is a silicon layer.

17. The method of claim 1 , wherein the bottom surface of the semiconductor waveguide is in contact with the first dielectric layer, the first sidewall of the semiconductor waveguide is in contact with the third dielectric layer, and the second sidewall of the semiconductor waveguide is in contact with the third dielectric layer.

18. The method of claim 1 , wherein the third dielectric layer is in contact with the first dielectric layer.

19. The method of claim 6 , wherein the bottom surface of semiconductor waveguide is in contact with the second dielectric layer, the first sidewall of the semiconductor waveguide is in contact with the third dielectric layer, and the second sidewall of the semiconductor waveguide is in contact with the third dielectric layer.

20. The method of claim 6 , wherein the third dielectric layer is in contact with the second dielectric layer.