Nonvolatile memory device

1. A nonvolatile memory device comprising:

a memory cell region including first metal pads; and

a peripheral circuit region including:

second metal pads;

a signal storage circuit configured to store control signals and a data signal received from external of the nonvolatile memory device;

a debugging information generator configured to generate debugging information based on the stored control signals and the stored data signal; and

a debugging information register configured to output the debugging information in response to a debugging information request from external of the nonvolatile memory device,

wherein the peripheral circuit region is vertically connected to the memory cell region by the first metal pads and the second metal pads.

2. The nonvolatile memory device of claim 1 , wherein the memory cell region further comprises:

a first input-output pad on the memory cell region; and

a third metal pad under the substrate and connected to the first input-output pad,

wherein the peripheral circuit region further comprises:

a fourth metal pad connecting the third metal pad and the debugging information register,

wherein the debugging information request is received at the debugging information register from the external of the nonvolatile memory device through the first input-output pad, the third metal pad and the fourth metal pad.

3. The nonvolatile memory device of claim 2 , wherein the memory cell region further comprises:

a second input-output pad on the memory cell region; and

a fifth metal pad under the substrate and connected to the second input-output pad,

wherein the peripheral circuit region further comprises a sixth metal pad, and

wherein the signal storage circuit communicate the data signal with the external of the nonvolatile memory device through the second input-output pad, the fifth metal pad and the sixth metal pad.

4. The nonvolatile memory device of claim 3 , wherein the signal storage circuit communicate the control signal and address signal with the external of the nonvolatile memory device through the second input-output pad, the fifth metal pad and the sixth metal pad.

5. The nonvolatile memory device of claim 1 , wherein the memory cell region further comprises:

a first input-output pad on the memory cell region; and

a third metal pad under the substrate and connected to the first input-output pad,

wherein the peripheral circuit region further comprises:

a fourth metal pad connecting the third metal pad and the debugging information register,

wherein the debugging information is output by the debugging information register to the external of the nonvolatile memory device through the fourth metal pad, the third metal pad and the first input-output pad.

6. The nonvolatile memory device of claim 5 , wherein the memory cell region further comprises:

a second input-output pad on the memory cell region; and

a fifth metal pad under the substrate and connected to the second input-output pad,

wherein the peripheral circuit region further comprises a sixth metal pad, and

wherein the signal storage circuit communicate the data signal with the external of the nonvolatile memory device through the second input-output pad, the fifth metal pad and the sixth metal pad.

7. The nonvolatile memory device of claim 6 , wherein the signal storage circuit communicate the control signal and address signal with the external of the nonvolatile memory device through the second input-output pad, the fifth metal pad and the sixth metal pad.

8. The nonvolatile memory device of claim 1 , wherein the debugging information request includes a debugging mode, and wherein the debugging information comprises information corresponding to the debugging mode.

9. The nonvolatile memory device of claim 1 , wherein the signal storage circuit stores the data signal as the debugging information when a rising edge of a write enable signal included in the control signals is detected.

10. The nonvolatile memory device of claim 1 , wherein the signal storage circuit is further configured to:

store a first value as the debugging information when a command latch enable signal included in the control signals is at a high level and a rising edge of a write enable signal included in the control signals is detected; and

store a second value as the debugging information when an address latch enable signal included in the control signals is at a high level and another rising edge of the write enable signal included in the control signals is detected.

11. The nonvolatile memory device of claim 10 , wherein the signal storage circuit stores a third value as the debugging information when a rising edge or a falling edge of a data strobe signal included in the control signals is detected.

12. The nonvolatile memory device of claim 1 , wherein the debugging information is generated by:

determining a validity of a command and an address included in the data signal based on a preset value; and

generating a value corresponding to the determined validity as the debugging information.

13. The nonvolatile memory device of claim 1 , wherein the debugging information is generated by:

determining a validity of a command included in the data signal and a validity of an address included in the data signal based on preset values; and

generating a number of valid commands and a number of valid addresses as the debugging information based on the determined validities.

14. The nonvolatile memory device of claim 1 , wherein the debugging information is generated by:

determining a validity of a command included in the data signal based on a preset value; and

calculating a number of valid operations corresponding to the command as the debugging information based on the determined validity.

15. The nonvolatile memory device of claim 1 , wherein the first metal pads and the second metal pads are formed of copper.

16. The nonvolatile memory device of claim 1 , wherein the first metal pads and the second metal pads are connected by bonding manner.

17. The nonvolatile memory device of claim 1 , wherein the memory cell region is formed on a first wafer and the peripheral circuit region is formed on a second wafer.

18. The nonvolatile memory device of claim 1 , wherein the peripheral circuit region further includes:

a substrate on which the signal storage circuit, the debugging information generator and the debugging information register are provided,

wherein the memory cell region further includes:

a plurality of memory cells; and

a plurality of word lines connected to the plurality of memory cells,

wherein as a distance between one of the plurality of word lines and the substrate of the peripheral circuit region increases, a width of the one of the plurality of word lines increases.

19. The nonvolatile memory device of claim 1 , wherein the memory cell region further includes:

a plurality of memory cells; and

a plurality of word lines connected to the plurality of memory cells and connected to the first metal pads,

wherein the peripheral circuit region further includes:

a row decoder connected to the second metal pads,

wherein the plurality of word lines in the memory cell region are connected to the row decider through the first metal pads and the second metal pads.

20. The nonvolatile memory device of claim 1 , wherein the memory cell region further includes:

a plurality of memory cells; and

a plurality of bit lines connected to the plurality of memory cells and connected to the first metal pads,

wherein the peripheral circuit region further includes:

a page buffer connected to the second metal pads,

wherein the plurality of word lines in the memory cell region are connected to the page buffer through the first metal pads and the second metal pads.