Display apparatus and manufacturing method thereof
The present disclosure relates to a display apparatus including a substrate, a thin film transistor disposed on the substrate, a first insulating layer disposed on a source electrode and a drain electrode of the thin film transistor, a light emitting diode disposed on the first insulating layer to emit light toward the substrate, a second insulating layer disposed on the first insulating layer to surround the light emitting diode, an upper electrode disposed on the second insulating layer, and a driver IC chip disposed above the upper electrode to be connected to the upper electrode. According to the above configuration, the driver IC chip is disposed on the back side of a light emitting surface of a display panel, so that a bezel is capable of being minimized or omitted, and manufacturing of the display apparatus is easy and manufacturing costs is reduced.
1. A display apparatus comprising:
a substrate;
a thin film transistor disposed on the substrate and comprising a semiconductor active layer, a gate electrode, a source electrode, and a drain electrode;
a first insulating layer disposed on the source electrode and the drain electrode;
a light emitting diode disposed on the first insulating layer to emit light toward the substrate and comprising a p-n diode, an anode, and a cathode;
a second insulating layer disposed on the first insulating layer to surround the light emitting diode;
an upper electrode disposed on the second insulating layer; and
a driver IC chip disposed above and connected to the upper electrode.
2. The display apparatus according to claim 1 , wherein
the thin film transistor and the light emitting diode are disposed not to overlap each other.
3. The display apparatus according to claim 1 , wherein
the substrate comprises a light emitting region in which the light emitting diode is disposed and a non-light emitting region in which the thin film transistor is disposed.
4. The display apparatus according to claim 3 , further comprising
a light absorbing layer disposed in the non-light emitting region.
5. The display apparatus according to claim 1 , wherein
the gate electrode is disposed above the semiconductor active layer.
6. The display apparatus according to claim 1 , wherein
the light emitting diode is individually or plurally picked up on a wafer by a transfer mechanism and transferred to the first insulating layer.
7. The display apparatus according to claim 1 , wherein
the light emitting diode is fixed on the first insulating layer by an adhesive coating.
8. The display apparatus according to claim 1 , wherein
the light emitting diode comprises a light emitting surface, and the light emitting surface is in contact with the first insulating layer.
9. The display apparatus according to claim 1 , wherein
the anode and the cathode are positioned on an upper surface of the light emitting diode.
10. The display apparatus according to claim 1 , wherein
the IC chip is connected to the upper electrode by an ACF bonding.
11. The display apparatus according to claim 1 , further comprising
an upper insulating layer disposed on the upper electrode.
12. A method of manufacturing a display apparatus comprising:
forming a pixel circuit comprising a thin film transistor on a substrate;
disposing a light emitting diode on the substrate to emit light toward the substrate;
forming a signal electrode to supply a data signal to the light emitting diode, a common ground electrode to provide ground to the light emitting diode and a repair light emitting diode, and a repair signal electrode to supply a data signal to the repair light emitting diode; and
performing a lighting test of the light emitting diode.
13. The method of manufacturing the display apparatus according to claim 12 , further comprising
disposing the repair light emitting diode in a repair region when the lighting test fails.
14. The method of manufacturing the display apparatus according to claim 13 , further comprising
connecting the repair light emitting diode to the repair signal electrode and the common ground electrode through a metal ink.
15. The method of manufacturing the display apparatus according to claim 13 , further comprising
cutting the signal electrode connected to an anode of the light emitting diode that fails to light.